4 Layer PCB

US$0.46-0.69 / Piece

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What is Printed Circuit Board Immersion Gold HASL+Lead Free PCB Manufacturer in China

Name: Printed Circuit Board Immersion Gold HASL+Lead Free PCB Manufacturer in China
Uploaded: 2023-04-23T08:32:19+08:00
Description: Company Presentation KEEP MOVING CIRCUITS CO., LTD(KMC) was founded in August, 2000, a hi-tech group enterprise now, Shen Zhen factory is located at Fuyong Town, Bao'an District,mainly produce sample

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Price

Min. Order Reference FOB Price

1 Piece US$0.46-0.69 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Flame Retardant Properties V0
Mechanical Rigid Rigid
Base Material Copper
Insulation Materials Organic Resin
Transport Package by Vacuum Packing in Cartons
Trademark KMC
Origin Shengzhen
Min. Hole Size 0.2mm
Min. Line Width&Spacing 0.1mm/0.1mm
Surface Finish Immersion Gold / HASL+Lead Free
Certificates UL, RoHS, SGS, ISO9001 ISO14000
Shipping DHL, UPS, TNT, FedEx, etc

Product Description

Company Presentation KEEP MOVING CIRCUITS CO., LTD(KMC) was founded in August, 2000, a hi-tech group enterprise now, Shen Zhen factory is located at Fuyong Town, Bao'an District,mainly produce sample and quick-turn up to middle volume PCB orders. Since 2011, for supporting all customers better ...

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Keep Moving Circuits Co., Ltd.

Diamond Member Since 2016

Audited Supplier

Business Type Manufacturer/Factory
Main Products Multilayer PCB, Flexible PCB, HDI PCB, LED PCB, PCBA, PCB+ Assembly, Rigid-Flex PCB, Double Sided PCB, High Frequency PCB, Alunimium PCB
Registered Capital 20000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

4 Layer PCB Comparison

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Transaction Info
	Quick View Printed Circuit Board Immersion Gold HASL+Lead Free PCB Manufacturer in China Contact Now	Quick View Factory Produce High Frequency and Half Hole Rogers 4003 1.6mm Thickness Enig Surface Finish Multilayer PCB Inductor Calculator Contact Now	Quick View Fr-4 Panasonic M6 Via in Pad Back Drilling Depth Milling Impedance Controlled Multilayer PCB Diagram for High Speed Board Contact Now	Quick View Blue Color 10layers Tg170 180 Enig 4u Surface 2 Step HDI Impedance Controlled Stack up Multi-Layer PCB Contact Now	Quick View Hybrid or Mixed Dielectric Boards Rt/Duroid Arlon 85n Soft Gold and Enepig Plating 8 Layer PCB Motherboard Contact Now
Price	US $ 0.46-0.69/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Base Material: Copper; Insulation Materials: Organic Resin; Min. Hole Size: 0.2mm; Min. Line Width&Spacing: 0.1mm/0.1mm; Surface Finish: Immersion Gold / HASL+Lead Free; Certificates: UL, RoHS, SGS, ISO9001 ISO14000; Shipping: DHL, UPS, TNT, FedEx, etc;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;
Supplier Name	Keep Moving Circuits Co., Ltd.	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd
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