Rigid Flexible PCB
US$2.80-3.30 / Piece
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What is One-Top Solution for FPC PCB Board Multilayer Rigid-Flex Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$2.80-3.30 / Piece

Sepcifications

  • Structure Rigid Flexible
  • Material Polyimide
  • Application Electronics Products
  • Insulation Materials Epoxy Resin
  • Transport Package Carton
  • Specification UL, RoHS, SGS, ISO9001 ISO14000
  • Trademark KMC
  • Origin Shenzhen
  • Model No Rigid Flex PCB
  • Min Solder Mask Thickness 10um
  • Surface Treatment Immersion Gold

Product Description

Welcome to Keep Moving Circuits Co., Ltd KEEP MOVING CIRCUITS CO., LTD was founded in August, 2000 a hi-tech enterprise, specializes in manufacture ,supply and export of high precision 1 layer ,2layer and multilayer PCB. Since Jan.2011,the core business are Multilayer(including HDI) middle ...

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Rigid Flexible PCB Comparison
Transaction Info
Price US $ 2.80-3.30/ Piece US $ 4.40-5.30/ Piece US $ 4.40-5.30/ Piece US $ 4.40-5.30/ Piece US $ 4.20-4.90/ Piece
Min Order 1 Pieces 500 Pieces 500 Pieces 500 Pieces 500 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T L/C, T/T L/C, T/T L/C, T/T
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 14001, ISO 20000, IATF16949 ISO 14001, ISO 20000, IATF16949 ISO 14001, ISO 20000, IATF16949 ISO 14001, ISO 20000, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Asia, Western Europe North America, Eastern Asia, Western Europe North America, Eastern Asia, Western Europe North America, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, ODM, Own Brand(KMC) OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Product Attributes
Specification
Structure: Rigid Flexible;
Material: Polyimide;
Application: Electronics Products;
Insulation Materials: Epoxy Resin;
Model No: Rigid Flex PCB;
Min Solder Mask Thickness: 10um;
Surface Treatment: Immersion Gold;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Newtrue;
Copper Thickness: 35um,1oz,2oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Layer: 1~8 Layers;
Color: Yellow;
PCB Assembly: Through-Hole;
Solder Heat Resistance: 10 Sec;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Newtrue;
Copper Thickness: 35um,1oz,2oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Layer: 1~8 Layers;
Color: Yellow;
PCB Assembly: Through-Hole;
Solder Heat Resistance: 10 Sec;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Newtrue;
Copper Thickness: 35um,1oz,2oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Layer: 1~8 Layers;
Color: Yellow;
PCB Assembly: Through-Hole;
Solder Heat Resistance: 10 Sec;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Newtrue;
Copper Thickness: 35um, 1oz, 2oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Layer: 1~8 Layers;
Color: Yellow;
PCB Assembly: Through-Hole;
Solder Heat Resistance: 10 Sec;
Supplier Name

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Powerful Environmental Protection Technology Co., Ltd

Diamond Member Audited Supplier

Guangzhou Powerful Environmental Protection Technology Co., Ltd

Diamond Member Audited Supplier

Guangzhou Powerful Environmental Protection Technology Co., Ltd

Diamond Member Audited Supplier

Guangzhou Powerful Environmental Protection Technology Co., Ltd

Diamond Member Audited Supplier