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What is Single Sided Flexible PCB, Double Sided Flexible PCB and Multilayer Flexible PCB

Name: Single Sided Flexible PCB, Double Sided Flexible PCB and Multilayer Flexible PCB
Uploaded: 2021-12-24T15:03:29+08:00
Description: Product Detail Basic Info Type: FPC Dielectric: PI Insulation Materials: LPI white solder mask or Coverlay Min. Hole Size: 0.2mm Min. Line Width&Spacing: 0.1mm/0.1mm Certificates: UL, RoHS, SGS, ISO90

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.30-0.50 / Piece

Sepcifications

Structure Single-Sided FPC
Material Polyimide
Combination Mode Adhesive Flexible Plate
Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive Conductive Silver Paste
Flame Retardant Properties V2
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Transport Package by Vacuum Packing in Cartons
Trademark KMC
Origin Shenzhen, Guangdong

Product Description

Product Detail Basic Info Type: FPC Dielectric: PI Insulation Materials: LPI white solder mask or Coverlay Min. Hole Size: 0.2mm Min. Line Width&Spacing: 0.1mm/0.1mm Certificates: UL, RoHS, SGS, ISO9001 ISO14000 Shipping: DHL, UPS, TNT, FedEx, etc Soldermask: White,Yellow Silkscreen: Black ...

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Keep Moving Circuits Co., Ltd.

Diamond Member Since 2016

Audited Supplier

Business Type Manufacturer/Factory
Main Products Multilayer PCB, Flexible PCB, HDI PCB, LED PCB, PCBA, PCB+ Assembly, Rigid-Flex PCB, Double Sided PCB, High Frequency PCB, Alunimium PCB
Registered Capital 20000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

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Transaction Info
	Quick View Single Sided Flexible PCB, Double Sided Flexible PCB and Multilayer Flexible PCB Contact Now	Quick View Camera Security Products FPC PCB Board, Flexible Printed Circuit Contact Now	Quick View Medical Device Usage FPC Circuit Board, Flexible PCB Board Contact Now	Enig Flexible Singled Sided PCB Circuit Board FPCB with 0.1 Laser Drill Contact Now	Quick View Consumer Electronics Products Printed PCB Rigid Flex Circuit Board Contact Now
Price	US $ 0.30-0.50/ Piece	US $ 0.10-80.00/ Piece	US $ 0.10-100.00/ Piece	US $ 0.01-150.00/ Piece	US $ 0.10-100.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	UL,ISO9001&ISO14001,SGS,RoHS,Ts16949	UL,ISO9001&ISO14001,SGS,RoHS,Ts16949	-	UL,ISO9001&ISO14001,SGS,RoHS,Ts16949
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, Own Brand	OEM	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Single-Sided FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin;	Structure: Multilayer FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Special Process: Stiffeners etc; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Enig Thickness: 1-3u''; Copper Weight: 0.5-8oz; Hard Gold Thickness: 5-50u'';	Structure: Multilayer FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Special Process: Stiffeners etc; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Enig Thickness: 1-3u''; Copper Thickness: 0.5-8oz; Hard Gold Thickness: 5-50u'';	Structure: Single-Sided FPC; Material: Polyimide; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Polyimide; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 0.2mm; Gold Thickness: 2u''; Layer: 1 Layer; Impendence: No;	Structure: Multilayer FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Special Process: Stiffeners etc; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Enig Thickness: 1-3u''; Copper Thickness: 0.5-8oz; Hard Gold Thickness: 5-50u'';
Supplier Name	Keep Moving Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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