Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Material Type: Fr4,High Tg,Cem1,Cem3,Aluminiaum Base,Arlon,Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Min Hole Size: Mechanical Hole: 0.15mm, Laser Hole: 0.1mm;
Outline Profile: Rout/ V-Cut/ Bridge/ Stamp Hole;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Min. Line Width: 4mil;
Max Production Size: 600*800mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Min Hole Size: Mechanical Hole: 0.15mm, Laser Hole: 0.1mm;
Outline Profile: Rout/ V-Cut/ Bridge/ Stamp Hole;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Min. Line Width: 4mil;
Max Production Size: 600*800mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 2oz;
Condition: Original Made;
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