High Tg PCB
US$0.38-2.57 / Piece
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What is Multilayer PCB Immersion Gold Fr4 Printed Circuit Board for Electronics Product Project

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.38-2.57 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology HASL Lf, Plating. Gold, Immersion Gold, Silver
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Model PCB
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package by Vacuum Packing in Cartons
  • Trademark KMC
  • Origin Shengzhen
  • Min. Hole Size 0.2mm
  • Min. Line Width&Spacing 3mil/4mil
  • Soldermask Green, Blue, White, Black, Yellow, Red
  • Silkscreen White, Black, Blue, Yellow
  • Shipping DHL, UPS, TNT, FedEx, etc
  • Certificates UL, RoHS, SGS, ISO9001 ISO14000

Product Description

Product Description Product Detail Basic Info Type:Multilayer PCB Min. Hole Size: 0.2mm Min. Line Width&Spacing: 0.1mm/0.1mm Certificates: UL, RoHS, SGS, ISO9001 ISO14000 Shipping: DHL, UPS, TNT, FedEx, etc Soldermask: Green,Blue,White,Black,Yellow,Red Silkscreen: White,Black Origin: ...

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High Tg PCB Comparison
Transaction Info
Price US $ 0.38-2.57/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T T/T T/T T/T
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Mid East, Western Europe North America, Eastern Europe, Mid East, Western Europe North America, Eastern Europe, Mid East, Western Europe North America, Eastern Europe, Mid East, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million
Business Model OEM, ODM, Own Brand(KMC) OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lf, Plating. Gold, Immersion Gold, Silver;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Shengyi, Kb, Nanya, Ilm;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 3mil/4mil;
Soldermask: Green, Blue, White, Black, Yellow, Red;
Silkscreen: White, Black, Blue, Yellow;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Supplier Name

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier