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Thermoelectric Separation Board Copper Base+St115b Material Metal Base 3.2mm Thickness Prepreg Multilayer PCB pictures & photos

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What is Thermoelectric Separation Board Copper Base+St115b Material Metal Base 3.2mm Thickness Prepreg Multilayer PCB

Name: Thermoelectric Separation Board Copper Base+St115b Material Metal Base 3.2mm Thickness Prepreg Multilayer PCB
Uploaded: 2024-05-09T20:08:28+08:00
Description: HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum /

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Sy Fr4
Insulation Materials Organic Resin
Brand Kxpcba
Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
Specification 5-500mm
Trademark KX
Origin Shenzhen of China
Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
Copper Weights 0.5oz~10oz
Layer Count 1-64 Layers
Stack up Control Dielectric/Control Impedance/Tdr Testing
Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
Stack Via 5step
Stagger Via 5step
Laser Via Hole Size 0.1mm
Filling Via Dimple Value <=15um
Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

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Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB PCBA, Stencil
Export Year 2019-03-01
Terms of Payment T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram, XT
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

HDI PCB Application Comparison

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Transaction Info
	Quick View Thermoelectric Separation Board Copper Base+St115b Material Metal Base 3.2mm Thickness Prepreg Multilayer PCB Contact Now	Quick View PCBA PCBA for AC/DC Fan Schematics Control Board Massage Chair Control Board Contact Now	Quick View Good Heat Resistancer PCB Manufacturer for Consumer Electronics with RoHS Contact Now	Quick View Good Heat Resistancer PCB Medical Equipment Board Manufacturer for Consumer Electronics with ISO16949 Contact Now	Quick View High Quality Custom Board Assembly PCB Based on Your Design Contact Now
Price	US $ 0.10-10.00/ Piece	US $ 0.10-100.00/ Piece	US $ 0.10-100.00/ Piece	US $ 0.10-100.00/ Piece	US $ 0.10-100.00/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P	L/C, T/T, D/P	L/C, T/T, D/P	L/C, T/T, D/P
Quality Control
Product Certification	-	RoHS, UL, ISO	RoHS, UL, ISO	RoHS, UL, ISO	RoHS, UL, ISO
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	South America, Europe, Southeast Asia/ Mideast, Africa, Domestic	South America, Europe, Southeast Asia/ Mideast, Africa, Domestic	South America, Europe, Southeast Asia/ Mideast, Africa, Domestic	South America, Europe, Southeast Asia/ Mideast, Africa, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	-	-	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Yldz; Test: 100% E-Test; Surface Treatment: 100% Tin; Board Thickness: 0.2-6mm; One Stop Service: PCB Assembly, Component Sourcing, Box Building; Solder Mask: Green; Layers: 1-36 Layers; Copper Thickness: 0.5-12oz(18-420um); a Special Process: Carbon Film Printing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Yldz; Test: 100% E-Test; Surface Treatment: 100% Tin; Board Thickness: 0.2-6mm; One Stop Service: PCB Assembly, Component Sourcing, Box Building; Solder Mask: Green; Layers: 1-36 Layers; Copper Thickness: 0.5-12oz(18-420um); a Special Process: Carbon Film Printing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Yldz; Test: 100% E-Test; Surface Treatment: 100% Tin; Board Thickness: 0.2-6mm; One Stop Service: PCB Assembly, Component Sourcing, Box Building; Solder Mask: Green; Layers: 1-36 Layers; Copper Thickness: 0.5-12oz(18-420um); a Special Process: Carbon Film Printing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Yldz; Test: 100% E-Test; Surface Treatment: 100% Tin; Board Thickness: 0.2-6mm; One Stop Service: PCB Assembly, Component Sourcing, Box Building; Solder Mask: Green; Layers: 1-36 Layers; Copper Thickness: 0.5-12oz(18-420um); a Special Process: Carbon Film Printing;
Supplier Name	Shenzhen Jinxiong Electronic Co., Ltd	Wenzhou Yongli Electronics Co, . Ltd	Wenzhou Yongli Electronics Co, . Ltd	Wenzhou Yongli Electronics Co, . Ltd	Wenzhou Yongli Electronics Co, . Ltd
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