HDI Rigid Flex PCB
US$0.10-10.00 / Piece
View
  • Recommend for you
  • What is Specialized 2oz 3oz Customized High Frequency PCB Circuit Board Rogers PCB Factory with Gold Plating Finger
  • What is PCBA Factory Manufacture Heavy Copper Add Date Code and UL Mark OEM Assembly Fr4 Printed Circuit Board Isola PCB Material
  • What is Leading Manufacturer 10 Layer and 16 Layer High Tg Board Multi-Layer Functions of PCB for Communication Machine

What is Local Power 120 Micro Inches Shenjin Power Surface Finish High Frequency 3 Step HDI Multilayer PCB Coil for Industrial Device

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Sy Fr4
  • Insulation Materials Organic Resin
  • Brand Kxpcba
  • Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
  • Specification 5-500mm
  • Trademark KX
  • Origin Shenzhen of China
  • Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
  • Copper Weights 0.5oz~10oz
  • Layer Count 1-64 Layers
  • Stack up Control Dielectric/Control Impedance/Tdr Testing
  • Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
  • Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
  • Stack Via 5step
  • Stagger Via 5step
  • Laser Via Hole Size 0.1mm
  • Filling Via Dimple Value <=15um
  • Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

Learn More

HDI Rigid Flex PCB Comparison
Transaction Info
Price US $ 0.10-10.00/ Piece US $ 1/ Piece US $ 1/ Piece US $ 1.00-5.00/ Piece US $ 1/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - FOB, EXW FOB, EXW FOB, EXW FOB, EXW
Payment Terms L/C, T/T, D/P, Western Union, Paypal, XT T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, East Asia(Japan/ South Korea) North America, Europe, East Asia(Japan/ South Korea) North America, Europe, East Asia(Japan/ South Korea) North America, Europe, East Asia(Japan/ South Korea)
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Supplier Name

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Elecsound Technology Company Limited

China Supplier - Gold Member Audited Supplier

Elecsound Technology Company Limited

China Supplier - Gold Member Audited Supplier

Elecsound Technology Company Limited

China Supplier - Gold Member Audited Supplier

Elecsound Technology Company Limited

China Supplier - Gold Member Audited Supplier