Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layers: 32 Layers;
Min Track / Spacing: 0.075 mm / 0.075 mm;
Min Hole Size: 0.10 mm;
Min Pad Size: 0.35 mm;
Rigid-Flex Thickness: 0.25 mm-6.0 mm;
Max Copper Thickness: 5 Oz;
Max Wpnl Size: 610 mm X 914 mm;
Finish Copper(Flex Part): 0.5-2 Oz;
Finish Copper(Rigid Part): 1-5 Oz;
Surface Finish: Enig, OSP, Immersion Silver, HASL, Caborn, Enepig;
Drilling Accuracy: +/-0.05 mm;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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