Specification |
Structure: Metal Base Rigid PCB;
Dielectric: Aluminum;
Material: Metal;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Kxpcba;
Layer Quantity: 1-4;
PCB Size: 300*1200mm;
Thermal Conductivity (ω/M-K): 1-12W/Mk;
Board Thickness: 0.8-6mm;
Min Tracing/Spacing: 4mil / 4mil;
Pth Size: Min 0.2mm;
Npth Size: Min 0.8mm;
Copper Thickness: 1-5oz;
Solder Mask: Any;
Surface Finish: HASL, OSP, Enig, Hard Gold, Enepig;
Countersinks, Castellated Holes: Yes;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Kb;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5 Days;
MOQ: 10PCS;
Delivery Time: 15 Days;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Kb;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5 Days;
MOQ: 10PCS;
Delivery Time: 15 Days;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Standard: Ipc Class 3;
Thickness: 2.0mm;
Solder Mask: Green;
Silk: White;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Kb;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
|