| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Kb;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5 Days;
MOQ: 10PCS;
Delivery Time: 15 Days;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finish: Enig/1u'';
Layer: 1-24;
Base: Fr-4 (Tg110-180), Rogers, Shenyi;
Material Finished Thickness: 0.2-5.0mm;
Finished Copper Thickness: 1oz;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 8 Working Days;
Fast Turn: 3 Working Days;
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Structure: Multilayer Rigid PCB;
Dielectric: High Frequency;
Material: Epoxy Glass;
Application: Industrial Control;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Finished Product;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customerised;
Surface Finihsing: Immersion/ Chemical Gold 3u'';
Array Size: 260.2*215.55mm;
Min Copper Clearance: 100um;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Customerised;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Ucreate;
Board Layer: 4;
Based Material: Iteq180;
Size: 290.2*180.5mm;
Surface Finish: OSP;
Material Finished Thickness: 1.6mm;
Finished Copper: All 1oz;
Solder Mask Color: Green;
PCB Testing: E-Testing; Flying Probe Testing;
Ipc Standard: Ipc Class II;
Lead Time: 7 Working Days;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Soldermask Color: Black;
Unit Size: 50*20mm;
Finised Copper Thcikness: 70/70um;
Surface Finish: Enig/1u'';
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