Fr4 Multilayer PCB

US$0.10-10.00 / Piece

View

3mm Thickness Enig Gold Electroplating High Tg 3 Oz Copper 18 Layers Factory Multilayer PCB Construction pictures & photos

Recommend for you
What is Reliable Manufacturer Antenna RF HDI Circuit Board Different Impedance 50 100 Ohm Rogers and Megtron PCB with Rapid Delivery Time
What is Fr4 1.6mm Thickness Panasonic M6 Mini Hole 0.25mm Inner Layer 4oz Whole Board Gold Plating 30u PCB Live Score
What is PCBA Factory Manufacture Heavy Copper Add Date Code and UL Mark OEM Assembly Fr4 Printed Circuit Board Isola PCB Material

What is 3mm Thickness Enig Gold Electroplating High Tg 3 Oz Copper 18 Layers Factory Multilayer PCB Construction

Name: 3mm Thickness Enig Gold Electroplating High Tg 3 Oz Copper 18 Layers Factory Multilayer PCB Construction
Uploaded: 2024-05-08T20:45:16+08:00
Description: HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum /

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Sy Fr4
Insulation Materials Organic Resin
Brand Kxpcba
Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
Specification 5-500mm
Trademark KX
Origin Shenzhen of China
Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
Copper Weights 0.5oz~10oz
Layer Count 1-64 Layers
Stack up Control Dielectric/Control Impedance/Tdr Testing
Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
Stack Via 5step
Stagger Via 5step
Laser Via Hole Size 0.1mm
Filling Via Dimple Value <=15um
Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

Learn More

Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB PCBA, Stencil
Export Year 2019-03-01
Terms of Payment T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram, XT
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Fr4 Multilayer PCB Comparison

	Quick View 3mm Thickness Enig Gold Electroplating High Tg 3 Oz Copper 18 Layers Factory Multilayer PCB Construction Contact Now	Quick View 1 Stop PCB Assembly PCBA Factory Print Circuit Board Contact Now	Quick View China Professional Factory OEM Multilayer PCB with Buried Blind Holes for Electronics Contact Now	Quick View One-Stop Circuit Board Multilayer Electronics PCB Solution Service Contact Now	Quick View High Frequency Circuit Board Multilayer PCB for Rogers Contact Now

Transaction Info
	Quick View 3mm Thickness Enig Gold Electroplating High Tg 3 Oz Copper 18 Layers Factory Multilayer PCB Construction Contact Now	Quick View 1 Stop PCB Assembly PCBA Factory Print Circuit Board Contact Now	Quick View China Professional Factory OEM Multilayer PCB with Buried Blind Holes for Electronics Contact Now	Quick View One-Stop Circuit Board Multilayer Electronics PCB Solution Service Contact Now	Quick View High Frequency Circuit Board Multilayer PCB for Rogers Contact Now
Price	US $ 0.10-10.00/ Piece	US $ 0.03-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-20.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, XT	T/T, D/P, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	-	-	RoHS, UL CE, GS, ISO	RoHS, UL CE, GS, ISO	RoHS, UL CE, GS, ISO
Management System Certification	-	ISO 9001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Western Europe	North America, South America, Western Europe	North America, South America, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Exceeding; Delivery: 24hours~5 Days; Service: 724 Hours Online;* Price: Factory Price; Keyword: Custom PCB; MOQ: 1 PCS; Min. Line Spacing: 0.075mm(3mil); Copper Thickness: 18um-3500um(0.5- 100oz); Min. Line Width: 0.075mm(3mil); Min Hole Size: 0.1mm(4mil); Testing Service: 100% E-Testing; Board Thickness: 0.2-6.0mm; Industrial: Industrial Control Board, Motherboard; Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger.OSP; Solder Mask: Green, White, Black, Blue, Red(Customized);	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Exceeding Electronics; Delivery: 24hours~5 Days; Service: 724 Hours Online;* Price: Factory Price; Keyword: Custom PCB; MOQ: 1PCS; Min. Line Spacing: 0.075mm(3mil); Copper Thickness: 18um-3500um(0.5- 100oz); Min. Line Width: 0.075mm(3mil); Min Hole Size: 0.1mm(4mil); Testing Service: 100% E-Testing; Board Thickness: 0.2-6.0mm; Industrial: Industrial Control Board, Motherboard; Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger.OSP; Solder Mask: Green, White, Black, Blue, Red(Customized);	Type: Rigid Circuit Board; Dielectric: Rogers; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Exceeding; Delivery: 24hours~5 Days; Price: Factory Price; Keyword: Custom PCB; Product Name: High Frequency PCB Board; MOQ: 1 PCS; Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil); Min. Line Width: 0.075mm(3mil); Copper Thickness: 0.5-12oz(18-420um); Min. Line Spacing: 0.075mm(3mil); Board Thickness: 0.2-6.0mm; Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free; Service: One-Stop Service, PCB Assembly, Component Supply; Testing Service: 100% E-Testing;
Supplier Name	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen New Chip international Ltd	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED
Select All

Contact Now

Hot Search