Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layers: 32 Layers;
Min Track / Spacing: 0.075 mm / 0.075 mm;
Min Hole Size: 0.10 mm;
Min Pad Size: 0.35 mm;
Rigid-Flex Thickness: 0.25 mm-6.0 mm;
Max Copper Thickness: 5 Oz;
Max Wpnl Size: 610 mm X 914 mm;
Finish Copper(Flex Part): 0.5-2 Oz;
Finish Copper(Rigid Part): 1-5 Oz;
Surface Finish: Enig, OSP, Immersion Silver, HASL, Caborn, Enepig;
Drilling Accuracy: +/-0.05 mm;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
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Insulation Materials: Metal Composite Materials;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Surface Finishes: Emig,HASL,OSP,etc.;
Soldermasker Color: White,Yellow,Green,Red,Black,etc.;
Copper Thickness: 1/3 Oz ~2 Oz;
Testing Service: Electrica Testing,Flying Probe Tester,Functional;
Min. Line Spacing: 0.075---0.09mm;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
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