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High Desity Interconnections PCB Multilayer 8 Layer Board High Quality Manufacturer HDI PCB Design HDI with Snap off Hole pictures & photos

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What is High Desity Interconnections PCB Multilayer 8 Layer Board High Quality Manufacturer HDI PCB Design HDI with Snap off Hole

Name: High Desity Interconnections PCB Multilayer 8 Layer Board High Quality Manufacturer HDI PCB Design HDI with Snap off Hole
Uploaded: 2024-05-09T15:52:30+08:00
Description: HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum /

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Sy Fr4
Insulation Materials Organic Resin
Brand Kxpcba
Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
Specification 5-500mm
Trademark KX
Origin Shenzhen of China
Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
Copper Weights 0.5oz~10oz
Layer Count 1-64 Layers
Stack up Control Dielectric/Control Impedance/Tdr Testing
Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
Stack Via 5step
Stagger Via 5step
Laser Via Hole Size 0.1mm
Filling Via Dimple Value <=15um
Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

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Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB PCBA, Stencil
Export Year 2019-03-01
Terms of Payment T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram, XT
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

BGA PCB Comparison

	Quick View High Desity Interconnections PCB Multilayer 8 Layer Board High Quality Manufacturer HDI PCB Design HDI with Snap off Hole Contact Now	Quick View Fr4 Printed Circuit Board Electronic Bare Board Single Layer Double Layer PCB Contact Now	Quick View Rigid PCB 0.1 0.2 mm Circuit Boards Copy Board Manufacturer Contact Now	Quick View Prototype Blank Bare Printed Circuit Boards Programmable Copper-Clad Capacitors Multilayer Dense Control DIY Wholesale Rigid-Flex PCB Suppliers Manufacturers Contact Now	Quick View PCB Order China High Quality Fabrication Rigid Flex PCB Circuit Boards Contact Now

Transaction Info
	Quick View High Desity Interconnections PCB Multilayer 8 Layer Board High Quality Manufacturer HDI PCB Design HDI with Snap off Hole Contact Now	Quick View Fr4 Printed Circuit Board Electronic Bare Board Single Layer Double Layer PCB Contact Now	Quick View Rigid PCB 0.1 0.2 mm Circuit Boards Copy Board Manufacturer Contact Now	Quick View Prototype Blank Bare Printed Circuit Boards Programmable Copper-Clad Capacitors Multilayer Dense Control DIY Wholesale Rigid-Flex PCB Suppliers Manufacturers Contact Now	Quick View PCB Order China High Quality Fabrication Rigid Flex PCB Circuit Boards Contact Now
Price	US $ 0.10-10.00/ Piece	US $ 1/ Piece	US $ 0.99-2.99/ Piece	US $ 0.99-2.99/ Piece	US $ 0.99-2.99/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, XT	T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	-	ISO9001, 14001, 13485, 45001, 50001-IATF16949-CQC-	ISO9001, 14001, 13485, 45001, 50001-IATF16949-CQC-	ISO9001, 14001, 13485, 45001, 50001-IATF16949-CQC-
Management System Certification	-	ISO 9001, ISO 14001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Max Layer Counts: 40 Layer; Max Copper Thickness: 14oz; Mininum Line Width: 3mil; Minimum Line Space: 3mil; UL Certificate: Yes; Sample Building: Yes; Quickturn Service: Yes; Country of Origin: China; Packing: Vacuum Packing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Cl; Layer: 24L; Service: OEM/ODM, EMS; Support: Fast Proofing; MOQ: a Slice; Ten Years: Export Trade Experience; Sales Model: Factory Direct; Quality Standard: Ipc-a-610 Class II & III, Ipc-a-620 Class II & III; Surface Finish: HASL, Enig, OSP, Gold Finger; Support One-Stop Service: PCB Manufacturing, Component Sourcing, SMT Placeme; Surface Finishing: HASL, Immersion Gold, OSP; Application Field: LED, Medical, Industrial, Control Board; Export Trade: More Than 10 Years; Lndustry Experience: Over 30 Years; Business Team Services: 724 Hours Online;*	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Cl; Layer: 24L; Service: OEM/ODM, EMS; Support: Fast Proofing; MOQ: a Slice; Ten Years: Export Trade Experience; Sales Model: Factory Direct; Quality Standard: Ipc-a-610 Class II & III, Ipc-a-620 Class II & III; Surface Finish: HASL, Enig, OSP, Gold Finger; Support One-Stop Service: PCB Manufacturing, Component Sourcing, SMT Placeme; Surface Finishing: HASL, Immersion Gold, OSP; Application Field: LED, Medical, Industrial, Control Board; Export Trade: More Than 10 Years; Lndustry Experience: Over 30 Years; Business Team Services: 724 Hours Online;*	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Cl; Layer: 24L; Service: OEM/ODM, EMS; Support: Fast Proofing; MOQ: a Slice; Ten Years: Export Trade Experience; Sales Model: Factory Direct; Quality Standard: Ipc-a-610 Class II & III, Ipc-a-620 Class II & III; Surface Finish: HASL, Enig, OSP, Gold Finger; Support One-Stop Service: PCB Manufacturing, Component Sourcing, SMT Placeme; Surface Finishing: HASL, Immersion Gold, OSP; Application Field: LED, Medical, Industrial, Control Board; Export Trade: More Than 10 Years; Lndustry Experience: Over 30 Years; Business Team Services: 724 Hours Online;*
Supplier Name	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Greenstone Technology Limited	Shenzhen Chenglixin Electronics Co., Ltd	Shenzhen Chenglixin Electronics Co., Ltd	Shenzhen Chenglixin Electronics Co., Ltd
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