HDI PCB Structure
US$0.10-10.00 / Piece
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About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Sy Fr4
  • Insulation Materials Organic Resin
  • Brand Kxpcba
  • Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
  • Specification 5-500mm
  • Trademark KX
  • Origin Shenzhen of China
  • Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
  • Copper Weights 0.5oz~10oz
  • Layer Count 1-64 Layers
  • Stack up Control Dielectric/Control Impedance/Tdr Testing
  • Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
  • Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
  • Stack Via 5step
  • Stagger Via 5step
  • Laser Via Hole Size 0.1mm
  • Filling Via Dimple Value <=15um
  • Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

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HDI PCB Structure Comparison
Transaction Info
Price US $ 0.10-10.00/ Piece US $ 0.39-2.19/ Piece US $ 0.39-2.19/ Piece US $ 0.39-2.19/ Piece US $ 0.59-1.21/ Square Meter
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Square Meters
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, XT T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - - - - ISO9001,14001,13485,45001,50001-IATF16949-CQC-Aeo
Management System Certification - ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM OEM, ODM OEM, ODM OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Type: Rigid Circuit Board, Rigid Circuit Board;
Dielectric: FR-4, Fr-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin, Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication, Consumer Electronics;
Flame Retardant Properties: V1, V0;
Mechanical Rigid: Rigid, Rigid;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Base Material: Copper, Copper;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Brand: Szx, Szx;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
Type: Rigid Circuit Board, Rigid Circuit Board;
Dielectric: FR-4, Fr-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin, Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication, Consumer Electronics;
Flame Retardant Properties: V1, V0;
Mechanical Rigid: Rigid, Rigid;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Base Material: Copper, Copper;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Brand: Szx, Szx;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
Type: Rigid Circuit Board, Rigid Circuit Board;
Dielectric: FR-4, Fr-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin, Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication, Consumer Electronics;
Flame Retardant Properties: V1, V0;
Mechanical Rigid: Rigid, Rigid;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Base Material: Copper, Copper;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Brand: Szx, Szx;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Cl;
Layer: 24L;
Service: OEM/ODM, EMS;
Support: Fast Proofing;
MOQ: a Slice;
Ten Years: Export Trade Experience;
Sales Model: Factory Direct;
Quality Standard: Ipc-a-610 Class II & III, Ipc-a-620 Class II & III;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Support One-Stop Service: PCB Manufacturing, Component Sourcing, SMT Placeme;
Surface Finishing: HASL, Immersion Gold, OSP;
Application Field: LED, Medical, Industrial, Control Board;
Export Trade: More Than 10 Years;
Lndustry Experience: Over 30 Years;
Business Team Services: 7*24 Hours Online;
Supplier Name

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzexin Electronic (Hongkong) Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzexin Electronic (Hongkong) Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzexin Electronic (Hongkong) Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Chenglixin Electronics Co., Ltd

China Supplier - Diamond Member Audited Supplier