PCBA

US$5.00 / Piece

View

Mustar Shenzhen OEM Electronic Engineering Industrial Control PCBA pictures & photos

Recommend for you
What is High Quality 1-64 Layers Copper PCB & PCBA Manufacture
What is Mustar Automotive Electronics Printed Circuit Board Assembly PCB and PCBA Manufacturer
What is High Quality Professional Custom Multilayer Medical Electronics PCB Assembly PCBA Supplier

What is Mustar Shenzhen OEM Electronic Engineering Industrial Control PCBA

Name: Mustar Shenzhen OEM Electronic Engineering Industrial Control PCBA
Uploaded: 2023-04-06T11:54:43+08:00
Description: One-stop PCB/PCBA/BOM service Mu Star (Shenzhen) Industry Co., Ltd. Focuses on One-stop PCBA manufacturing service Since 1998. We have rich experience on customize Medical & Automotive & New En

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$5.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Complex
Application Medical Instruments
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Mu Star
Transport Package ESD Bag/ Bubble Package
Specification Customized
Trademark Mu Star
Origin China
Certificate ISO9001/Ts16949/RoHS/Ts16949
Color Customized
Testing Service Aoi/ X-ray/ Fai
Board Thickness 1.6mm
Number of Layers 1-58 Layers

Product Description

One-stop PCB/PCBA/BOM service Mu Star (Shenzhen) Industry Co., Ltd. Focuses on One-stop PCBA manufacturing service Since 1998. We have rich experience on customize Medical &Automotive &New Energy field. We cooperated with 50 famous brand customer over $2,000,000 per year. Mu Star has factory ...

Learn More

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products PCBA, PCB Assembly, PCB, Electronic Component, IC
Number of Employees 35
Year of Establishment 2021-12-16
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCBA Comparison

	Quick View Mustar Shenzhen OEM Electronic Engineering Industrial Control PCBA Contact Now	Quick View PCBA USB Flash Drive PCB Board Contact Now	Quick View Cheap China PCB Control Board PCBA Assembly Contact Now	Quick View PCB Manufacture Mobile Phone Circuit Board OEM Circuit Board 2 Layer Fr4 Assembled PCBA Contact Now	Quick View Air Conditioning Circuit Board PCBA Amplifier Assembly Smart Home Custom PCB Assembly Other PCB PCBA Factory Contact Now

Transaction Info
	Quick View Mustar Shenzhen OEM Electronic Engineering Industrial Control PCBA Contact Now	Quick View PCBA USB Flash Drive PCB Board Contact Now	Quick View Cheap China PCB Control Board PCBA Assembly Contact Now	Quick View PCB Manufacture Mobile Phone Circuit Board OEM Circuit Board 2 Layer Fr4 Assembled PCBA Contact Now	Quick View Air Conditioning Circuit Board PCBA Amplifier Assembly Smart Home Custom PCB Assembly Other PCB PCBA Factory Contact Now
Price	US $ 5/ Piece	US $ 0.20-20.00/ Piece	US $ 0.20-20.00/ Piece	US $ 0.76-5.00/ Piece	US $ 0.78-22.31/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T	T/T
Quality Control
Product Certification	ISO9001/Ts16949/RoHS/Ts16949	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Complex; Application: Medical Instruments; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Mu Star; Color: Customized; Testing Service: Aoi/ X-ray/ Fai; Board Thickness: 1.6mm; Number of Layers: 1-58 Layers;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Mu Star (shenzhen) Industry Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
Select All

Contact Now

Hot Search