Ics Chip

US$0.10-0.50 / Piece

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What is Customized High-Level Quality Circuit Board PCBA/PCB Manufacturer for Intelligent Electronics

Name: Customized High-Level Quality Circuit Board PCBA/PCB Manufacturer for Intelligent Electronics
Uploaded: 2023-10-11T16:02:25+08:00
Description: Product Parameters Packaging & Shipping Packaging Detail: Anti-static bag, bubble pack, carton box,Vacuum... Delivery Detail: 3-15Days, delivery just-in-time Company Profile NEW CHIP INTERNATIONAL

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-0.50 / Piece

Sepcifications

Type Flexible Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China

Product Description

Product Parameters Packaging &Shipping Packaging Detail: Anti-static bag, bubble pack, carton box,Vacuum... Delivery Detail: 3-15Days, delivery just-in-time Company Profile NEW CHIP INTERNATIONAL LIMITED (Hereafter called NEW CHIP) is a professional agent and distributor of electronic ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Rating & Reviews: 4.5/5.0

(2 Reviews)

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Number of Employees 10
Year of Establishment 2022-05-11
Management System Certification ISO 9001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

Ics Chip Comparison

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Transaction Info
	Customized High-Level Quality Circuit Board PCBA/PCB Manufacturer for Intelligent Electronics Contact Now	Quick View 94V0 Rosh 5V Power Bank Board Printed Circuit Board Assembly Ome One Stop Service Bom PCBA Service HDI PCB Technology Contact Now	Quick View with Fast Delivery and Controlled Impedance HDI PCB One-Stop PCBA Service Multilayer PCB for Aerospace and Defense Field Contact Now	Quick View PCB Design Customization OEM and ODM Electronics PCBA Custom Manufacturer Multilayer Printed Circuit Board with UL Contact Now	Quick View Custom Electronic Wearable PCBA Circuit Boards Design Plastic Housing Injection Factory HDI Printed Circuit Board Contact Now
Price	US $ 0.10-0.50/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT
Quality Control
Management System Certification	ISO 9001, IATF16949	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million
Business Model	OEM, ODM	OEM, ODM, Own Brand(KX)	OEM, ODM, Own Brand(KX)	OEM, ODM, Own Brand(KX)	OEM, ODM, Own Brand(KX)
Average Lead Time	-	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;
Supplier Name	Shenzhen New Chip international Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd
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