High-Quality Custom LED PCB Single Layer and Double Layers Material LED Floor Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.25-1.35 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand New Chip
  • Transport Package Vacuum Packaging, Carton Box
  • Specification FR-4 SILICON COMPONENTS
  • Trademark New Chip
  • Origin China
  • Layer 1-32 Layers
  • Service OEM/ODM
  • OEM/ODM Available
  • Test 100%E-Testing
  • Layer Count 1-20 Layers
  • Shipping DHL/UPS/FedEx/Air/Sea
  • Surface Treatmen OSP, Enig, HASL, AG Immersion
  • Certificate Gurantee Yes

Product Description

Product Description What we offer: Products Application: Communication, internet, industrial control, computer application, consumptive electronics, spaceflight, curative application Etc. Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Taconic, Rogers*, ...

Learn More

PCB Comparison
Transaction Info
Price US $ 0.25-1.35/ Piece US $ 0.5/ Piece US $ 0.01-5.00/ piece US $ 0.01-10.00/ piece US $ 0.10-0.50/ pcs
Min Order 1 Pieces 100 Pieces 1 piece 1 piece 1 pcs
Payment Terms T/T, D/P, Western Union T/T, Western Union, Paypal, 30 days net L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net T/T, Western Union, Paypal, 30 days net
Quality Control
Management System Certification ISO 9001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$1 Million - US$2.5 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, ODM OEM OEM OEM OEM
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Auto;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Board Thickness: 0.15/0.8/1.0/1.6/2.0/2.4/2.8/3.0/3.2mm;
Inner Copper: 1/2/3/4 Oz;
Finish Copper: 1/2/3/4 Oz;
Surface Finish: Enig/HASL/HASL Lf/OSP;
Solder Mask: Green/White/Red/Orange/Purple;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Auto;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Thickness Tolerance(T≥0.8mm): +/-8%;
Thickness Tolerance(T<0.8mm): +/-10%;
Insulation Layer Thickness: 0.075mm--5.00mm;
SMT Mini.Solder Mask Width: 0.075mm;
Mini. Solder Mask Clearance: 0.05mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Auto;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Insulation Layer Thickness: 0.075mm--5.00mm;
Minimum Line: 0.075mm;
Minimum Space: 0.075mm;
Diameter Tolerance(Mechanical): 0.05mm;
Registration(Mechanical): 0.075mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Auto;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Supplier Name

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier