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US$0.03-10.00 / Piece

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Double-Sided PCB Boards Factory Customized Multi Layer Printed Circuit Board Manufacture PCB pictures & photos

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What is Double-Sided PCB Boards Factory Customized Multi Layer Printed Circuit Board Manufacture PCB

Name: Double-Sided PCB Boards Factory Customized Multi Layer Printed Circuit Board Manufacture PCB
Uploaded: 2023-10-11T16:15:33+08:00
Description: Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.08

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.03

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File, Protel Series, ...
Material for PCB Fr-4, High Tg Fr$, Halogen Free
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

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Shenzhen New Chip international Ltd

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Number of Employees 10
Year of Establishment 2022-05-11
Management System Certification ISO 9001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

PCBA Manufacturing Comparison

	Quick View Double-Sided PCB Boards Factory Customized Multi Layer Printed Circuit Board Manufacture PCB Contact Now	4 Layer High Quality LED PCB Contact Now	Cem-1 94V0 PCB, Multilayer PCB Contact Now	Electronic Lock PCB Circuit Board Contact Now	Quick View 6 Layer PCB for Security System with 1.6mm Thickness Contact Now

Transaction Info
	Quick View Double-Sided PCB Boards Factory Customized Multi Layer Printed Circuit Board Manufacture PCB Contact Now	4 Layer High Quality LED PCB Contact Now	Cem-1 94V0 PCB, Multilayer PCB Contact Now	Electronic Lock PCB Circuit Board Contact Now	Quick View 6 Layer PCB for Security System with 1.6mm Thickness Contact Now
Price	US $ 0.03-10.00/ Piece	US $ 0.01/ Piece	US $ 0.1/ Piece	US $ 0.15/ Piece	US $ 30.00-80.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW	FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW	FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA	FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
Payment Terms	T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	UL, RoHS, SGS, ISO 9001, Ect	UL, RoHS, SGS, ISO 9001, Ect	UL, SGS, RoHS, Ect	-
Management System Certification	ISO 9001, IATF16949	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: LED; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Board Thickness: 1.6mm; Layer: 1 to 28 Layers; Meterial Type: Fr-4, Cem-1, High Tg, Fr4 Halogen Free, Rogers; Copper Thickness: 1oz; Min Hole Size: 0.2mm; Min Line Width: 0.1mm; Min Line Spacing: 0.1mm; Surface Finishing: Immersion Gold; Package: Vacuum;	Type: Rigid Circuit Board; Dielectric: CEM-1; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Surface Finishing: HASL; Copper Thickness: 35um; Board Thickness: 1.6mm; Min. Hole Size: 0.1mm; Min. Line Wigth: 0.075mm; Min. Line Spacing: 0.075mm; Layer: 1 to 18; Package: Vacuum;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Electronic Lock; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Copper Thickness: 2oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Space: 0.075mm; Min. Line Width: 0.075mm; Solder Mask: Green; Test: Aoi; Package: Vacuum Package; Shipping: UPS, DHL, FedEx, Ect;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Security System; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Copper Thickness: 1oz; Surface Finishing: Immersion Gold; Solder Mask Type: Green; Silkscreen: White; Board Thickness: 2.0mm; Min. Hole Size: 0.2mm; Min. Line Width: 0.15mm; Min. Line Spacing: 0.15mm; Certificates: UL, RoHS, SGS, ISO9001; Shipping: DHL, UPS, TNT, FedEx, etc;
Supplier Name	Shenzhen New Chip international Ltd	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.
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