Specification |
shape: SMD;
Technics: Semiconductor IC;
Core Processor: Arm Cortex-M4;
Core Size: 32-Bit Single-Core;
Speed: 72MHz;
Connectivity: Canbus, IrDA, Linbus, Spi, Uart/Usart, USB;
Peripherals: DMA, I²s, Por, PWM, Wdt;
Number of I/O: 52;
Program Memory Size: 128kb (128K X 8);
Program Memory Type: Flash;
RAM Size: 32K X 8;
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V;
Operating Temperature: -40°c ~ 85°c (Ta);
Package / Case: 64-Lqfp;
Data Converters: a/D 22X12b; D/a 2X12b;
Oscillator Type: Internal;
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shape: Flat;
Conductive Type: Bipolar Integrated Circuit;
Integration: GSI;
Technics: Semiconductor IC;
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Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series,...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
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Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
|
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series,...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
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