PCB
US$0.031-0.42 / Piece
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Top Quality Circuit Board, PCB Board & PCBA Assembly Factory Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.031-0.42 / Piece

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric FR-4
  • Material Fr4
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Semi-Additive Process
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Transport Package Inner Vacuum Packing Outer Carton Box
  • Specification FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
  • Trademark OKEY
  • Origin Guangdong Shenzhen, China
  • Color Green, Blue, Black, Red, Yellow etc.
  • Certificate ISO UL RoHS and Reach
  • Surface Finish Lead Free HASL

Product Description

Technical Capabilities Items Speci. Remark Max panel size 32" x 20.5"(800mm x 520mm) Max. Board size 2000×610mm Min. board Thickness 2-layer 0.15mm 4-layer 0.4mm 6-layer 0.6mm 8-layer 1.5mm 10-layer 1.6~2.0mm Min. line Width/Space 0.1mm(4mil) Max. ...

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PCB Comparison
Transaction Info
Price US $ 0.031-0.42/ Piece US $ 0.95-2.10/ Piece US $ 0.95-2.10/ Piece US $ 0.95-2.10/ Piece US $ 1.50-4.50/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 10 Pieces
Trade Terms FOB, CIF, FCA, EXW - - - -
Payment Terms L/C, T/T, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal T/T, Western Union, Paypal, Money Gram, Alipay, Alibaba Trade Assurance Order
Quality Control
Product Certification ISO UL RoHS and Reach ISO9001, ISO16949, RoHS ISO9001, ISO16949, RoHS ISO9001, ISO16949, RoHS -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14000, IATF16949, GMP
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM, Others
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Color: Green, Blue, Black, Red, Yellow etc.;
Surface Finish: Lead Free HASL;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Impedance Control Accuracy: ±8%;
Minimum Solder Resist Opening: 1.5mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Impedance Control Accuracy: ±8%;
Minimum Solder Resist Opening: 1.5mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Impedance Control Accuracy: ±8%;
Minimum Solder Resist Opening: 1.5mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCB Testing: PCB: Ict Testing and Flying Probe Testing;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
PCB Materials: Fr4;
PCB Soldermask: Green;
PCB Silkscreen: White;
PCB Tg: Tg170;
IC: Qfn;
IC Type: BGA;
SMT: 01005;
PCBA Testing: Function Testing 100%;
Supplier Name

Shenzhen Okey Circuit Co., Ltd.

China Supplier - Diamond Member Audited Supplier

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier