PCB

US$0.031-0.42 / Piece

High Quality Printed Circuit Board PCBA Design PCB Assembly pictures & photos

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What is High Quality Printed Circuit Board PCBA Design PCB Assembly

Name: High Quality Printed Circuit Board PCBA Design PCB Assembly
Uploaded: 2022-06-20T14:48:23+08:00
Description: Technical Capabilities Items Speci. Remark Max panel size 32" x 20.5"(800mm x 520mm) Max. Board size 2000×610mm Min. board Thickness 2-layer 0.15mm 4-layer 0.4mm 6-layer 0.6mm 8-laye

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Price

Min. Order Reference FOB Price

1 Piece US$0.031-0.42 / Piece

Sepcifications

Structure Double-Sided Rigid PCB
Dielectric FR-4
Material Fr4
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Copper
Insulation Materials Organic Resin
Transport Package Inner Vacuum Packing Outer Carton Box
Specification FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
Trademark OKEY
Origin Guangdong Shenzhen, China
Color Green, Blue, Black, Red, Yellow etc.
Certificate ISO UL RoHS and Reach
Surface Finish Lead Free HASL

Product Description

Technical Capabilities Items Speci. Remark Max panel size 32" x 20.5"(800mm x 520mm) Max. Board size 2000×610mm Min. board Thickness 2-layer 0.15mm 4-layer 0.4mm 6-layer 0.6mm 8-layer 1.5mm 10-layer 1.6~2.0mm Min. line Width/Space 0.1mm(4mil) Max. ...

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Shenzhen Okey Circuit Co., Ltd.

Diamond Member Since 2013

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB, PCB Board, Circuit Board, Printed Circuit Board, PCB Assembly, PCB Manufactory, Aluminum PCB, LED PCB, LED Board, Flexible PCB
Registered Capital 2000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

PCB Comparison

	High Quality Printed Circuit Board PCBA Design PCB Assembly Contact Now	Quick View Fr4 Tg150 1.5mm 8layer Immersion Gold Min. Space 3.9mil Circuit Board PCB Contact Now	Quick View Imm Gold Min. Hole to Line 7mil Impedance Control 8layer Motherboard PCB Contact Now	Quick View Enig Impedance Control PCB BGA to Line 3.5mil 8layer Circuit Board PCB Contact Now	Quick View 1.5mm Enig Min. Trace Line&Space 3.9mil 8layer PCB for Router/Modem/Switch Contact Now

Transaction Info
	High Quality Printed Circuit Board PCBA Design PCB Assembly Contact Now	Quick View Fr4 Tg150 1.5mm 8layer Immersion Gold Min. Space 3.9mil Circuit Board PCB Contact Now	Quick View Imm Gold Min. Hole to Line 7mil Impedance Control 8layer Motherboard PCB Contact Now	Quick View Enig Impedance Control PCB BGA to Line 3.5mil 8layer Circuit Board PCB Contact Now	Quick View 1.5mm Enig Min. Trace Line&Space 3.9mil 8layer PCB for Router/Modem/Switch Contact Now
Price	US $ 0.031-0.42/ Piece	US $ 0.28-3.10/ Piece	US $ 0.295-3.30/ Piece	US $ 0.275-3.60/ Piece	US $ 0.265-3.55/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	ISO UL RoHS and Reach	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$5 Million - US$10 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Fr4; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Organic Resin; Color: Green, Blue, Black, Red, Yellow etc.; Surface Finish: Lead Free HASL;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Other: Fr4 Tg150; Min. Space: 3.9mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Other: Impedance Control; Min. Hole to Line: 7mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Other: Impedance Control; BGA to Line: 3.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Min. Trace Line&Space: 3.9mil; Inner Core Material: 0.1mm;
Supplier Name	Shenzhen Okey Circuit Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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