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What is Making Circuit Boards Fast PCB Prototyping PCB Board Production 12 Layer PCB Manufacturer

Name: Making Circuit Boards Fast PCB Prototyping PCB Board Production 12 Layer PCB Manufacturer
Uploaded: 2023-08-11T11:11:24+08:00
Description: Making circuit boards fast pcb prototyping pcb board production 12 layer pcb manufacturer Shenzhen HonLynn circuit Co.,Ltd. is a High-level standard PCB customized manufacturing, a National High t

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-20.00 / Piece

Sepcifications

Type Rigid Circuit Board
Material Fr4-Kb
Application Security Engineer
Flame Retardant Properties V0
Mechanical Rigid Rigid
Base Material Copper
Insulation Materials Epoxy Resin
Brand Hl-PCB
Transport Package Vacuum Packing/Blister/Plastic /Carton
Trademark HonLynn Circuit
Origin Shenzhen, Guangdong
Surface Treatment Immersion Au
Mini Hole Diameter 0.2mm
Borad Thickness 1.6mm
Count Layer 4
Inner/Outer Copper Thickness 1oz/1oz
Min Trace Width/Spacing 4mil/4mil
Special Balck Printing Ink, Resin Plug Vias
Certificated ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.

Product Description

Making circuit boards fast pcb prototyping pcb board production 12 layer pcb manufacturer Shenzhen HonLynn circuit Co.,Ltd. is a High-level standard PCB customized manufacturing, a National High tech professional precise new enterprice. We certificated UL, ISO9001, ISO14001, ISO / TS16949, ...

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Shenzhen Honglian Circuit Co., Ltd.

Gold Member Since 2022

Audited Supplier

Rating & Reviews： 5.0/5.0

(3 Reviews)

Business Type Manufacturer/Factory
Main Products Multilayer PCBs, Rigid, Flex, Rigid Flex, Metal Core
Number of Employees 316
Year of Establishment 2014-12-11
Management System Certification ISO9001:2015, ISO14001:2015, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

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Transaction Info
	Quick View Making Circuit Boards Fast PCB Prototyping PCB Board Production 12 Layer PCB Manufacturer Contact Now	Quick View Double Multilayer PCB Board for Smart Home Contact Now	Quick View Six Multilayer PCB OSP Board for Network Data Communication Contact Now	Quick View Ten Multilayer PCB HDI Board for Vr Devices with Immersion Gold Contact Now	Quick View Eight Multilayer PCB Board for Air Humidifiers with Immersion Gold Contact Now
Price	US $ 0.10-20.00/ Piece	US $ 3.91-3.92/ Piece	US $ 3.91-3.92/ Piece	US $ 3.91-3.92/ Piece	US $ 3.91-3.92/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal, Money Gram	T/T	T/T	T/T	T/T
Quality Control
Management System Certification	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic	-	-	-	-
Annual Export Revenue	-	-	-	-	-
Business Model	-	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	-	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Material: Fr4-Kb; Application: Security Engineer; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Hl-PCB; Surface Treatment: Immersion Au; Mini Hole Diameter: 0.2mm; Borad Thickness: 1.6mm; Count Layer: 4; Inner/Outer Copper Thickness: 1oz/1oz; Min Trace Width/Spacing: 4mil/4mil; Special: Balck Printing Ink, Resin Plug Vias; Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;
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