Specification |
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Test: Flying Probe and Fixture;
Solder Mask: Green;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 0.3mm / 0.16mm / 1.8mm / Custom;
Custom: OEM / ODM;
Copper: 1oz / 35um, 0.5oz / 18um;
Surface Finish: HASL / Enig;
Layers: 1-4 Layers;
Legend: White;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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