| Specification |
Condition: New;
Speed: Super High Speed;
Precision: High Precision;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
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Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Binding Force: 500 N (Max);
Wafer Size: Wafer Size: 8" - 12" (4", 6" Customizable);
Substrate Type: Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe;
Uph: up to 10,000 Pieces Per Hour (Max);
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Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Binding Force: 10~7,500 G (Programmable);
Uph: 7000(Max);
X/Y Placement Accuracy: ± 7µm @ 3σ;
Theta Placement Accuracy: ±0.15°@ 3σ;
Bonding Head Heatingtemperatur: up to 350 °c (Optional);
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After-sales Service: 7*24 Hour After-Sales Service;
Condition: New;
Speed: Medium Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Placement Process: Eutectic, Underfill;
Equipment Application: Coc,COB,Gold Box,Cow,Cos;
Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan;
Workbench: 2;
Wafer: 6 Inch, Supports up to 4 Piece;
Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces;
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After-sales Service: 7*24 Hour After-Sales Service;
Condition: New;
Speed: Medium Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Placement Process: Eutectic, Underfill;
Equipment Application: Coc,COB,Gold Box,Cow,Cos;
Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan;
Workbench: 2;
Wafer: 6 Inch, Supports up to 4 Piece;
Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces;
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