2.4G WiFi+Bluetooth Core-Esp32-C3 Development Board Verification Esp32c3

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$1.75-2.15 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric SIC
  • Material Synthetic Fiber
  • Application Medical Instruments
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Transport Package Bag
  • Specification 51.6*21*4.3mm
  • Origin Cn
  • Item Core Development Board
  • Model Esp32-C3
  • Memory 4MB Flash
  • Function Verify The Esp32c3 Chip
  • BLE Bluetooth 5.0

Product Description

Core ESP32-C3 Development Board Used to verify the ESP32C3 chip function 2.4G Product features: 1. The core board is designed based on ESP32-C3, with a size of only 21*51mm 2. The board edge adopts a stamp hole design, which is convenient for developers to use in different scenarios 3. The ...

Learn More

Core-Esp32 Comparison
Transaction Info
Price US $ 1.75-2.15/ Piece US $ 0.32/ Piece US $ 0.01-150.00/ Piece US $ 0.01-100.00/ Piece US $ 0.5/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, D/P, Western Union, Paypal, Alipay T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Paypal T/T, Paypal
Quality Control
Management System Certification - ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets - North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - US$10 Million - US$50 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model - OEM, Own Brand(Bicheng) OEM OEM OEM
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: SIC;
Material: Synthetic Fiber;
Application: Medical Instruments;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Item: Core Development Board;
Model: Esp32-C3;
Memory: 4MB Flash;
Function: Verify The Esp32c3 Chip;
BLE: Bluetooth 5.0;
Type: Rigid Circuit Board;
Dielectric: RO4350b 30mil;
Material: Hydrocarbon/Woven Glass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon;
Final Foil External: 1.5 Oz;
Final Foil Internal: 1 Oz;
Board Thickness: 1.0 mm ±10%;
Surface Finish: Immersion Gold, 85%;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 5 Mil / 4.9 Mil;
Minimum / Maximum Holes: 0.25 mm / 3.17 mm;
Via: Plated Through Hole(Pth);
Test: 100% Electrical Test Prior Shipment;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: N/a;
Board Thickness: 1.6 mm;
Surface: Immersion Gold 2u'';
Others: Gold Finger;
Solder Masik: Blue;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Abis;
Layer: 8 Layers;
Board Thickness: 1.6mm;
Surface Finish: Immersion Gold;
Raw Material: Fr4 Tg170;
Solder Mask: Green;
Legend: White;
Copper Thickness: 35/70/70/35um;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Abis;
Layer: 6;
Board Thickness: 1.6mm;
Surface Finish: Enig;
Raw Material: Fr4;
Inner Copper: 1oz;
Outer Copper: 1oz;
Solder Mask: Green;
Legend: White;
Supplier Name

Sunhokey Electronics Co., Ltd.

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier