Wafer Thinner

US$20,000.00-60,000.00 / Piece

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New Horizontal Automatic High Speed CNC Silicon Wafer Thinning Machine pictures & photos

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How to Use New Horizontal Automatic High Speed CNC Silicon Wafer Thinning Machine

Name: New Horizontal Automatic High Speed CNC Silicon Wafer Thinning Machine
Uploaded: 2023-12-01T16:07:51+08:00
Description: Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electro

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$20,000.00-60,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine, Surface Grinding Machine
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Variable Speed with Variable Speed
Application Grinding Industry
Service Oversea Setup & After-Sale Avalaible
Class Thinner
Process Station 1
Abrasive Recyclable Water & Grinding Wheel
Wheel Rotate Speed 0-3000 Rpm
Workpiece Accuracy Control(Parallelism) 1um
Power of Grinding Wheel Motor 5.5kw

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Wafer Thinner Comparison

	Quick View New Horizontal Automatic High Speed CNC Silicon Wafer Thinning Machine Contact Now	Sc Bead Mill Price Made in China Contact Now	Pin Sand Mill/Bead Mill for Nano Grinding Contact Now	Ele Water-Based Ink Production Equipment Contact Now	Ele Offset /Flexo / Gravure / Cameo / Screen Printing Ink Making Machine Contact Now

Transaction Info
	Quick View New Horizontal Automatic High Speed CNC Silicon Wafer Thinning Machine Contact Now	Sc Bead Mill Price Made in China Contact Now	Pin Sand Mill/Bead Mill for Nano Grinding Contact Now	Ele Water-Based Ink Production Equipment Contact Now	Ele Offset /Flexo / Gravure / Cameo / Screen Printing Ink Making Machine Contact Now
Price	US $ 20,000.00-60,000.00/ Piece	US $ 2,000.00-30,000.00/ Piece	US $ 2,000.00-30,000.00/ Piece	US $ 2,000.00-30,000.00/ Piece	US $ 2,000.00-30,000.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T	L/C, T/T	L/C, T/T	L/C, T/T
Quality Control
Product Certification	ISO 9001	CE, RoHS, ISO 9001	CE, RoHS, ISO 9001	CE, RoHS, ISO 9001	CE, RoHS, ISO 9001
Management System Certification	ISO 9001	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: 1-3 Month(s)	Off-season: within 15 Day(s) Peak-season: 1-3 Month(s)	Off-season: within 15 Day(s) Peak-season: 1-3 Month(s)	Off-season: within 15 Day(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine, Surface Grinding Machine; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Variable Speed: with Variable Speed; Application: Grinding Industry; Service: Oversea Setup & After-Sale Avalaible; Class: Thinner; Process Station: 1; Abrasive: Recyclable Water & Grinding Wheel; Wheel Rotate Speed: 0-3000 Rpm; Workpiece Accuracy Control(Parallelism): 1um; Power of Grinding Wheel Motor: 5.5kw;	Type: Multi-Use Grinding Machine; Processing Object: Ink, Paint, Pigment; Abrasives: Zirconium Bead; Controlling Mode: Electric Control System; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Ink, Paint, Pigment; Precision: High Precision; Condition: New; Function: Wet Grinding/ Milling; Grinding Medium: Zirconia Beads; Applicable Industry: Coating, Paint, Ink, Pigment, Latex; Bead Materials: Stainless Steel or Pure Zirconia; Usage: Industrial; Product Type: Horizontal; Material: Hard Alloy/Ss/304/316L/Ceramic; Certifcation: Ce/SGS/ISO; Performance: Nano&Micron Grinding; OEM/ODM: Acceptable; Cooling System: Circulating Liquid Cooling; Self-Protection: Auto-Stop Function;	Type: Multi-Use Grinding Machine; Processing Object: Ink, Paint, Pigment; Abrasives: Zirconium Bead; Controlling Mode: Electric Control System; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Ink, Paint, Pigment; Precision: High Precision; Condition: New; Function: Wet Grinding/ Milling; Grinding Medium: Zirconia Beads; Applicable Industry: Coating, Paint, Ink, Pigment, Latex; Bead Materials: Stainless Steel or Pure Zirconia; Usage: Industrial; Product Type: Horizontal; Material: Hard Alloy/Ss/304/316L/Ceramic; Certifcation: Ce/SGS/ISO; Performance: Nano&Micron Grinding; OEM/ODM: Acceptable; Cooling System: Circulating Liquid Cooling; Self-Protection: Auto-Stop Function;	Type: Multi-Use Grinding Machine; Processing Object: Ink, Paint, Pigment; Abrasives: Zirconium Bead; Controlling Mode: Electric Control System; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Ink, Paint, Pigment; Precision: High Precision; Condition: New; Function: Wet Grinding/ Milling; Grinding Medium: Zirconia Beads; Applicable Industry: Coating, Paint, Ink, Pigment, Latex; Bead Materials: Stainless Steel or Pure Zirconia; Usage: Industrial; Product Type: Horizontal; Material: Hard Alloy/Ss/304/316L/Ceramic; Certifcation: Ce/SGS/ISO; Performance: Nano&Micron Grinding; OEM/ODM: Acceptable; Cooling System: Circulating Liquid Cooling; Self-Protection: Auto-Stop Function;	Type: Multi-Use Grinding Machine; Processing Object: Ink, Paint, Pigment; Abrasives: Zirconium Bead; Controlling Mode: Electric Control System; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Ink, Paint, Pigment; Precision: High Precision; Condition: New; Function: Wet Grinding/ Milling; Grinding Medium: Zirconia Beads; Applicable Industry: Coating, Paint, Ink, Pigment, Latex; Bead Materials: Stainless Steel or Pure Zirconia; Usage: Industrial; Product Type: Horizontal; Material: Hard Alloy/Ss/304/316L/Ceramic; Certifcation: Ce/SGS/ISO; Performance: Nano&Micron Grinding; OEM/ODM: Acceptable; Cooling System: Circulating Liquid Cooling; Self-Protection: Auto-Stop Function;
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