Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6L up to 60L;
Board Thickness: 1.4mm up to 8mm;
Min Hole Size: 0.2mm;
Min. Hole Wall Cu: 20um;
Finished Copper: 35um;
Min. Trace/Space: 5/4mil;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 10L up to 60L;
Board Thickness: 1.2mm up to 8mm;
Min Hole Size: 0.2mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 51um;
Min. Trace/Space: 5.5/4mil;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 12L up to 60L;
Board Thickness: 1.6mm up to 8mm;
Min Hole Size: 0.2mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 45um;
Min. Trace/Space: 0.154/0.088mm;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6L up to 60L;
Board Thickness: 1.0mm up to 8mm;
Min Hole Size: 0.25mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 35um;
Min. Trace/Space: 0.233/0.173mm;
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