Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 2oz;
Condition: Original Made;
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Type: Rigid Circuit Board;
Material: Fr4-S1141;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Gold;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.6mm;
Count Layer: 6;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 4mil/4mil;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
Special: Impedance Control, Halogen Free Board, Resin Plug;
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Type: Rigid Circuit Board;
Material: Fr4-S1141;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Lead Free HASL;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 3oz/3oz;
Min Trace Width/Spacing: 10mil/10mil;
Special: High Reliability, 3oz Thick Cu Power Supply;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Type: Rigid Circuit Board;
Material: Fr4-Kb;
Application: Automative Light;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Au;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.2mm;
Count Layer: 2;
Inner/Outer Copper Thickness: 1oz;
Min Trace Width/Spacing: 8mil/8mil;
Special: Printing Mark Clearly, Strict Tolerance;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Type: Combining Rigid Circuit Board;
Material: Cu Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: OSP;
Mini Hole Diameter: 0.5mm;
Borad Thickness: 1.6mm;
Count Layer: 2;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 10mil/10mil;
Special: Cu Substrate, Good Heat Dissipation for Power;
Certificated: ISO9001, ISO14001, IATF16949, UL, RoHS, CQC etc.;
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