PCB Board

US$0.08-0.10 / PCS

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94V0 Printed Circuit Board for Smartphone with Multilayer pictures & photos

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What is 94V0 Printed Circuit Board for Smartphone with Multilayer

Name: 94V0 Printed Circuit Board for Smartphone with Multilayer
Uploaded: 2023-09-01T15:36:19+08:00
Description: Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling ma

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Price

Purchase Qty. Reference FOB Price

1-9 PCS US$0.10

10-99 PCS US$0.09

100+ PCS US$0.08

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Uc
Transport Package Vacuum Packing
Specification IPC-Class 2
Trademark Ucreate PCB
Origin Shenzhen China
Board Thickness 1.2~2.0mm
Surface Finihsing Immersional Gold
Lead Time 6-8 Working Days
Certificate ISO,UL,RoHS
PCB Testing E-Testing; Flying Probe Testing
Mask Ink Color White/Black/Green/Red/Yellow/Blue
Color Green Blue Red
Number of Layers 2 Layer
Copper Thickness 1oz
Condition Original Made

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic ...

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Ucreate PCB Co., Ltd.

Diamond Member Since 2016

Audited Supplier

Rating & Reviews： 5.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Computer Products, Consumer Electronics, Electrical & Electronics, Industrial Equipment & Components, Light Industry & Daily Use, Lights & Lighting, Manufacturing & Processing Machinery
Main Products Yes
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Terms of Payment LC, T/T, D/P, PayPal, Western Union
OEM/ODM Availability Yes

PCB Board Comparison

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Transaction Info
	Quick View 94V0 Printed Circuit Board for Smartphone with Multilayer Contact Now	Quick View SMT DIP ODM Smart Watch Circuit Board Smart Wear PCBA PCB Assembly Control Board PCB Assembly Contact Now	Quick View PCBA USB Flash Drive PCB Board Contact Now	Quick View Cheap China PCB Control Board PCBA Assembly Contact Now	Quick View PCB Manufacture Mobile Phone Circuit Board OEM Circuit Board 2 Layer Fr4 Assembled PCBA Contact Now
Price	US $ 0.08-0.10/ PCS	US $ 0.65-5.00/ Piece	US $ 0.20-20.00/ Piece	US $ 0.20-20.00/ Piece	US $ 0.76-5.00/ Piece
Min Order	1 PCS	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union	T/T	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T
Quality Control
Product Certification	ISO,UL,RoHS	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Uc; Board Thickness: 1.2~2.0mm; Surface Finihsing: Immersional Gold; Lead Time: 6-8 Working Days; PCB Testing: E-Testing; Flying Probe Testing; Mask Ink Color: White/Black/Green/Red/Yellow/Blue; Color: Green Blue Red; Number of Layers: 2 Layer; Copper Thickness: 1oz; Condition: Original Made;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Ucreate PCB Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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