Multilayer PCB

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What is Smart Devices PCB Design and Firmware Development Service

Name: Smart Devices PCB Design and Firmware Development Service
Uploaded: 2023-11-07T16:23:30+08:00
Description: Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet v

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Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Resin
Application Communication
Processing Technology Electrolytic Foil
Production Process Immersion Gold
Base Material It180A
Transport Package Bubble Pack+Aluminum Foil Pack
Origin China
Board Thickness 1.6mm
Copper Thickness 2oz
Test Flying Probe & Fixture
Solder Mask Type Green
Min.Line Width/Space 0.1mm
Min. Hole Size 0.2mm
Certification RoHS, CCC, ISO, EPA
Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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Usun Electronics Limited.,

Gold Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Export Year 2013-05-23
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

Multilayer PCB Comparison

	Smart Devices PCB Design and Firmware Development Service Contact Now	Quick View Material Em825 Resin Plug-in Hole HDI PCB for POS Machine Main Board Contact Now	Quick View 10layer HDI PCB for Security NVR Main Board and Interphone Contact Now	Quick View 12layer Blue Soldermask Immersion Gold HDI PCB for Security Interphone Contact Now	Quick View Securitycam Camera Material Em825 Enig HDI PCB Contact Now

Transaction Info
	Smart Devices PCB Design and Firmware Development Service Contact Now	Quick View Material Em825 Resin Plug-in Hole HDI PCB for POS Machine Main Board Contact Now	Quick View 10layer HDI PCB for Security NVR Main Board and Interphone Contact Now	Quick View 12layer Blue Soldermask Immersion Gold HDI PCB for Security Interphone Contact Now	Quick View Securitycam Camera Material Em825 Enig HDI PCB Contact Now
Price	US $ 0.50-10.00/ Piece	US $ 1.62-18.60/ Piece	US $ 1.74-19.30/ Piece	US $ 1.75-19.40/ Piece	US $ 0.67-12.53/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	RoHS, CCC, ISO, EPA	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	Above US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM, Own Brand()	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: It180A; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;	Structure: HDI PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 4layer - 10layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Special Material: Em825; Blind/Buried Vias: 0.1mm Laser Drilling; Other: Plugging Hole with Resin;	Structure: HDI PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6layer - 12layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Special Material: Em825, S1000h; Blind/Buried Vias: 0.1mm Laser Drilling;	Structure: HDI PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6layer - 12layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Special Material: Em825, S1000h; Blind/Buried Vias: 0.1mm Laser Drilling;	Structure: HDI PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6layer - 12layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Special Material: Em825, S1000h; Blind/Buried Vias: 0.1mm Laser Drilling;
Supplier Name	Usun Electronics Limited.,	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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