Multilayer PCB
US$0.50-10.00 / Piece
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What is Original Electronic Custom PCB Printed Circuit Board Schematic Diagram PCBA Layout Design

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Resin
  • Application Communication
  • Processing Technology Electrolytic Foil
  • Production Process Immersion Gold
  • Base Material It180A
  • Transport Package Bubble Pack+Aluminum Foil Pack
  • Origin China
  • Board Thickness 1.6mm
  • Copper Thickness 2oz
  • Test Flying Probe & Fixture
  • Solder Mask Type Green
  • Min.Line Width/Space 0.1mm
  • Min. Hole Size 0.2mm
  • Certification RoHS, CCC, ISO, EPA
  • Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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Multilayer PCB Comparison
Transaction Info
Price US $ 0.50-10.00/ Piece US $ 1.25-1.37/ Piece US $ 1.10-1.20/ Piece Negotiable US $ 1.50-4.50/ Piece
Min Order 1 Pieces 10 Pieces 10 Pieces 5 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram, Alipay, Alibaba Trade Assurance Order
Quality Control
Product Certification RoHS, CCC, ISO, EPA - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 - ISO 9001, ISO 14000, IATF16949, GMP
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe - - North America, South America, Europe, Australia North America, Eastern Europe, Africa, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM OEM, ODM - OEM, ODM, Others
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: HASL;
Structure: Standard;
Dielectric: Standard;
Material: Standard;
Application: Consumer Electronics;
Flame Retardant Properties: Standard;
Processing Technology: Standard;
Production Process: Standard;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Ckmcu;
Sku: 42215;
MOQ: 5;
Delivery Time: 7days;
Support Customization: Yes;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCB Testing: PCB: Ict Testing and Flying Probe Testing;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
PCB Materials: Fr4;
PCB Soldermask: Green;
PCB Silkscreen: White;
PCB Tg: Tg170;
IC: Qfn;
IC Type: BGA;
SMT: 01005;
PCBA Testing: Function Testing 100%;
Supplier Name

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Chipskey Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier