Multilayer PCB

US$0.50-10.00 / Piece

EMS PCB PCBA Mainboard Manufacturing for The IoT pictures & photos

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What is EMS PCB PCBA Mainboard Manufacturing for The IoT

Name: EMS PCB PCBA Mainboard Manufacturing for The IoT
Uploaded: 2024-06-17T14:56:52+08:00
Description: Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet v

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Resin
Application Communication
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Immersion Gold
Base Material S1000-2m/It180A
Transport Package Bubble Pack+Aluminum Foil Pack
Specification 158.5mm*76.5mm
Origin China
Layers 10L
Board Thickness 1.57mm
Copper Thickness 2oz
Test Flying Probe & Fixture
Solder Mask Type Blue
Silkscreen Type White
Min.Line Width/Space 0.1mm
Min. Hole Size 0.25mm
Surface Finish Enig 2u"
X-Outs Allowed Not Allowed
Standard Ipcii Class 2
Certification RoHS, CCC, ISO, EPA
Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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Usun Electronics Limited.,

Gold Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Export Year 2013-05-23
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

Multilayer PCB Comparison

	EMS PCB PCBA Mainboard Manufacturing for The IoT Contact Now	Quick View Multilayer 3oz Copper It158 Circuit Board PCB for Power UPS Contact Now	Quick View Heavy Copper 5oz High Multilayer Circuit Board 12layer PCB for Power Equipment Contact Now	Quick View 6oz Heavy Copper Mainboard Immersion Gold PCB for Power Equipment Contact Now	Quick View Matrial S1000-2 High Frequency Power Supply PCB with HASL-Lf Surface Finish Contact Now

Transaction Info
	EMS PCB PCBA Mainboard Manufacturing for The IoT Contact Now	Quick View Multilayer 3oz Copper It158 Circuit Board PCB for Power UPS Contact Now	Quick View Heavy Copper 5oz High Multilayer Circuit Board 12layer PCB for Power Equipment Contact Now	Quick View 6oz Heavy Copper Mainboard Immersion Gold PCB for Power Equipment Contact Now	Quick View Matrial S1000-2 High Frequency Power Supply PCB with HASL-Lf Surface Finish Contact Now
Price	US $ 0.50-10.00/ Piece	US $ 1.92-4.64/ Piece	US $ 2.28-5.69/ Piece	US $ 2.47-6.38/ Piece	US $ 0.435-1.82/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	RoHS, CCC, ISO, EPA	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	Above US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM, Own Brand()	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: S1000-2m/It180A; Layers: 10L; Board Thickness: 1.57mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Blue; Silkscreen Type: White; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.25mm; Surface Finish: Enig 2u"; X-Outs Allowed: Not Allowed; Standard: Ipcii Class 2; Customized: Customized;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Power; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 8L up to 24L; Board Thickness: 2.4mm up to 8mm; Min Hole Size: 0.6mm; Min. Hole Wall Cu: 30um; Finished Copper: 3/3 Oz;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Power; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 12L up to 24L; Board Thickness: 3.3mm up to 8mm; Min Hole Size: 0.4mm; Min. Hole Wall Cu: 50-60um; Finished Copper: 5/5 Oz;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Power; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 10L up to 24L; Board Thickness: 3.96mm up to 8mm; Min Hole Size: 0.35mm; Min. Hole Wall Cu: 30um; Finished Copper: 6/6 Oz;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Power; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 6L up to 24L; Board Thickness: 1.5mm up to 8mm; Min Hole Size: 0.65mm; Min. Hole Wall Cu: 25um; Finished Copper: 1/1oz;
Supplier Name	Usun Electronics Limited.,	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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