Multilayer PCB
US$0.50-10.00 / Piece
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What is PCB Electronic Board PCB Circuit Design

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Resin
  • Application Communication
  • Processing Technology Electrolytic Foil
  • Production Process Immersion Gold
  • Base Material It180A
  • Transport Package Bubble Pack+Aluminum Foil Pack
  • Origin China
  • Board Thickness 1.6mm
  • Copper Thickness 2oz
  • Test Flying Probe & Fixture
  • Solder Mask Type Green
  • Min.Line Width/Space 0.1mm
  • Min. Hole Size 0.2mm
  • Certification RoHS, CCC, ISO, EPA
  • Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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Multilayer PCB Comparison
Transaction Info
Price US $ 0.50-10.00/ Piece US $ 99.00-199.00/ Piece US $ 0.19-1.99/ Piece US $ 0.19-1.99/ Piece US $ 0.30-0.68/ Piece
Min Order 1 Pieces 10 Pieces 1 Pieces 1 Pieces 5 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal T/T, D/P, Paypal
Quality Control
Product Certification RoHS, CCC, ISO, EPA - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue Above US$100 Million Above US$100 Million US$5 Million - US$10 Million US$5 Million - US$10 Million US$2.5 Million - US$5 Million
Business Model OEM, ODM, Own Brand() OEM, ODM, Own Brand(Head Sun) OEM, ODM, Own Brand(Chounmtech) OEM, ODM, Own Brand(Chounmtech) OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Metal Base Rigid PCB;
Dielectric: FR-1;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Head Sun;
Machine No. 1: Hds Live 7;
Machine No. 2: Hds Live 9;
Machine No. 3: Hds Live 12;
Machine No. 4: Hds Live 16;
Machine No. 5: Hds PRO 16;
Machine No. 6: Hds-7 Carbon;
Machine No. 7: Hds-9 Carbon;
Machine No. 8: Hds-12 Carbon;
Machine No. 9: Hds-16 Carbon;
Machine No. 10: Hds 9 Gen 2 Touch;
Machine No. 11: Hds 9 Gen 3 Touch;
Machine No. 12: Hds 12 Gen 2 Touch;
Machine No. 13: Hds 12 Gen 3 Touch;
Machine No. 14: Hds 8 Insight USA;
Machine No. 15: Hds-8;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Turnkey Service: PCB Manufacturing +Purchase Components+Assembly;
Layer: 1-48 Layers;
Solder Mask Color: Green/Black/Red/Blue/Yellow/White/;
Shipping: DHL, FedEx, UPS;
Copper Thickness: 0.5oz-6oz;
Min. Order Quantity: 5 Pieces;
Max. Pth/Npth Size: Pth:6.35mm Npth: 6.35mm;
Min.Hole Size: Pth : 0.1mm Npth : 0.2mm;
Tolerance: +/-0.075mm;
Supplier Name

Usun Electronics Limited.,

Gold Member Audited Supplier

Head Sun Co., Ltd.

Diamond Member Audited Supplier

Canm Technology Co.,Ltd

Gold Member Audited Supplier

Canm Technology Co.,Ltd

Gold Member Audited Supplier

ShenZhen BeiGao Electronic Co.,Ltd

Gold Member Audited Supplier