What is PCB 8-Layer High Frenquency PCBA Board

Name: PCB 8-Layer High Frenquency PCBA Board
Uploaded: 2024-06-21T15:38:22+08:00
Description: Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet v

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Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Resin
Application Communication
Processing Technology Electrolytic Foil
Production Process Immersion Gold
Base Material It180A
Transport Package Bubble Pack+Aluminum Foil Pack
Origin China
Board Thickness 1.6mm
Copper Thickness 2oz
Test Flying Probe & Fixture
Solder Mask Type Green
Min.Line Width/Space 0.1mm
Min. Hole Size 0.2mm
Certification RoHS, CCC, ISO, EPA
Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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Usun Electronics Limited.,

Gold Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Export Year 2013-05-23
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

Multilayer PCB Comparison

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Transaction Info
	PCB 8-Layer High Frenquency PCBA Board Contact Now	Quick View Customized 1-24 Layers Fr4 PCB Board Assembly and SMT/DIP Process Service PCBA Contact Now	Quick View China Supplier PCB QC 3.0 Pd 20W 5V 3.4A USB Charger Power Bank PCBA Circuit Boards Contact Now	4 Layers Multi-Layer Rigid PCB Printed Circuit Board with Immersion Gold for Electronics Communication Contact Now	Quick View DC 5V 5A Adjustable LED Display PCBA Timer Control PCBA Switch Board PCB Contact Now
Price	US $ 0.50-10.00/ Piece	US $ 0.49-1.98/ Piece	US $ 0.50-6.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.50-6.00/ Piece
Min Order	1 Pieces	10 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Paypal	T/T	T/T, Western Union, Paypal	T/T
Quality Control
Product Certification	RoHS, CCC, ISO, EPA	ISO9001/ISO14001/IATF16949	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000	ISO 9001, ISO 14000, IATF16949, GMP	ISO 9001, ISO 14000, IATF16949, GMP	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14000, IATF16949, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, Eastern Europe, Africa, Mid East, Western Europe	North America, Eastern Europe, Africa, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Africa, Mid East, Western Europe
Annual Export Revenue	Above US$100 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$50 Million - US$100 Million	US$10 Million - US$50 Million
Business Model	OEM, ODM, Own Brand()	OEM, ODM, IMS service	OEM, ODM, IMS service	OEM	OEM, ODM, IMS service
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: It180A; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Jxpcba; PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency; Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin; PCB Solder Mask: White, Black, Yellow, Green, Red, Blue; Component Packing: Tary, Tube, Tape; Number of Floors: 1-32; Minimum Line Width/Spacing: 3.0mil; Maximum Plate Thickness Aperture Ratio: 30:1; Minimum Mechanical Drilling Aperture: 6mil; Board Thickness: 0.2mm~6.0mm; Maximum Board Size: 640mm1100mm;* PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test; PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop; Product Application: Consumer Electronics/Home Appliances/Medical Equip; PCB Silkscreen Color: Black, White, Yellow;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Jingxin;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Abis; Copper Thickness: 1 Oz; Board Layer: 1-20 Layers; Board Thickness: 1.6mm; Surface Finish: Gold Plating, Enig; Solder Mask: Green/Custom; Legend: White;	Structure: Single-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Jingxin;
Supplier Name	Usun Electronics Limited.,	Shenzhen Jingxin Electronic Technology Co., Ltd.	Shenzhen Jingxin Electronic Technology Co., Ltd.	Abis Circuits Co., Ltd.	Shenzhen Jingxin Electronic Technology Co., Ltd.
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