Multilayer PCB

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What is Custom PCB Board Design PCB Layout Design PCBA Assembly Integrated Circuit

Name: Custom PCB Board Design PCB Layout Design PCBA Assembly Integrated Circuit
Uploaded: 2024-06-21T16:38:18+08:00
Description: Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet v

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Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Resin
Application Communication
Processing Technology Electrolytic Foil
Production Process Immersion Gold
Base Material It180A
Transport Package Bubble Pack+Aluminum Foil Pack
Origin China
Board Thickness 1.6mm
Copper Thickness 2oz
Test Flying Probe & Fixture
Solder Mask Type Green
Min.Line Width/Space 0.1mm
Min. Hole Size 0.2mm
Certification RoHS, CCC, ISO, EPA
Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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Usun Electronics Limited.,

Gold Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Export Year 2013-05-23
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

Multilayer PCB Comparison

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Transaction Info
	Custom PCB Board Design PCB Layout Design PCBA Assembly Integrated Circuit Contact Now	Quick View Customizing PCB Military Electronics Module Multilayer Motherboard Contact Now	Quick View Military Class Printed Circuit Board for Sensor Amplifier RFID System Contact Now	Quick View It158 Material Costomize 16layer PCB Circuit Board for RFID Read and Write Module Contact Now	Quick View Customizing Multilayer PCB 12layer Circuit Board for Digital Temperature & Humidity Sensors Contact Now
Price	US $ 0.50-10.00/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	RoHS, CCC, ISO, EPA	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	Above US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM, Own Brand()	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: It180A; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Military; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6L up to 60L; Board Thickness: 1.0mm up to 8mm; Min Hole Size: 0.25mm; Min. Hole Wall Cu: 25um; Finished Copper: 35um; Min. Trace/Space: 0.233/0.173mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Military; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6L up to 60L; Board Thickness: 1.6mm up to 8mm; Min Hole Size: 0.25mm; Min. Hole Wall Cu: 25um; Finished Copper: 35um; Min. Trace/Space: 0.23/0.13mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Military; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 16L up to 60L; Board Thickness: 1.89mm up to 8mm; Min Hole Size: 0.25mm; Min. Hole Wall Cu: 25um; Finished Copper: 35um; Min. Trace/Space: 0.075/0.0905mm; Surface Finish: Immersion Gold;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Military; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 12L up to 60L; Board Thickness: 2mm up to 8mm; Min Hole Size: 0.25mm; Min. Hole Wall Cu: 25um; Finished Copper: 45um; Min. Trace/Space: 0.129/0.107mm; Surface Finish: Immersion Gold Au3u";
Supplier Name	Usun Electronics Limited.,	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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