Multilayer PCB

US$0.50-10.00 / Piece

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18-Layers PCB Board PCBA Assembly Manufacturer Multilayer Board pictures & photos

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What is 18-Layers PCB Board PCBA Assembly Manufacturer Multilayer Board

Name: 18-Layers PCB Board PCBA Assembly Manufacturer Multilayer Board
Uploaded: 2024-06-19T11:14:48+08:00
Description: Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet v

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Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Resin
Application Communication
Processing Technology Electrolytic Foil
Production Process Immersion Gold
Base Material It180A
Transport Package Bubble Pack+Aluminum Foil Pack
Origin China
Board Thickness 1.6mm
Copper Thickness 2oz
Test Flying Probe & Fixture
Solder Mask Type Green
Min.Line Width/Space 0.1mm
Min. Hole Size 0.2mm
Certification RoHS, CCC, ISO, EPA
Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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Usun Electronics Limited.,

Gold Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Export Year 2013-05-23
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

Multilayer PCB Comparison

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Transaction Info
	18-Layers PCB Board PCBA Assembly Manufacturer Multilayer Board Contact Now	Quick View Electronic Fan PCB Board Manufacturer Contact Now	Quick View XJY 18W LED 24V0 PCB Contact Now	Quick View Car Bluetooth Printed Circuit Board Contact Now	Quick View MP3 MP4 Player PCB Board Contact Now
Price	US $ 0.50-10.00/ Piece	US $ 0.1/ Piece	US $ 0.323/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, cash	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	RoHS, CCC, ISO, EPA	RoHS, UL, SGS, Ect	UL, RoHS, SGS, ISO 9001, Ect	RoHS, UL, SGS, Ect	RoHS, UL, SGS, Ect
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	Above US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM, Own Brand()	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: It180A; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: HASL; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Green; Size: 6656mm;* Package: Vacuum;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Fr-4; Brand: Xjy-PCB; Board Thickness: 1.0mm, 1.6mm; Layer: 1 to 8 Layers; Meterial Type: Fr-4, Cem-1, High Tg, Fr4 Halogen Free, Rogers; Min Hole Size: 3mil; Min Line Width: 3mil; Min Line Spacing: 3mil; Copper Thickness: 0.5 to 7oz; Shipping: UPS, FedEx, DHL, Ect; Package: Vacuun;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: HASL; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Green; Size: 6656mm;* Package: Vacuum;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: HASL; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Green; Size: 6656mm;* Package: Vacuum;
Supplier Name	Usun Electronics Limited.,	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.
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