Factory
US$0.50-10.00 / Piece
  • Recommend for you
  • What is SMD PCB Board Flexible Board Rigid PCB
  • What is Custom Made PCB PCBA Manufacturing for Telecommunication Devices
  • What is SMT PCB Assemble Printed Circuit Board Electronic Components

What is Circuit Board Prototype PCB Fabrication Factory From China

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Resin
  • Application Communication
  • Processing Technology Electrolytic Foil
  • Production Process Immersion Gold
  • Base Material It180A
  • Transport Package Bubble Pack+Aluminum Foil Pack
  • Origin China
  • Board Thickness 1.6mm
  • Copper Thickness 2oz
  • Test Flying Probe & Fixture
  • Solder Mask Type Green
  • Min.Line Width/Space 0.1mm
  • Min. Hole Size 0.2mm
  • Certification RoHS, CCC, ISO, EPA
  • Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

Learn More

Factory Comparison
Transaction Info
Price US $ 0.50-10.00/ Piece US $ 0.10-5.00/ Piece US $ 0.68-1.68/ Piece US $ 0.63-1.68/ Piece Negotiable
Min Order 1 Pieces 1 Pieces 10 Pieces 10 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net T/T, Paypal T/T, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification RoHS, CCC, ISO, EPA - ISO9001/ISO14001/CE/RoHS ISO9001/ISO14001/CE/RoHS ISO9001, ISO14000, Ts16949.UL.RoHS
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue Above US$100 Million US$50 Million - US$100 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$5 Million - US$10 Million
Business Model OEM, ODM, Own Brand() OEM OEM, ODM, IMS service OEM, ODM, IMS service OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.5mm;
Copper Thickness: 1oz;
Surface Finish: Immersion Gold;
Solder Mask: Blue;
Legend: White/Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
PCB Silkscreen Color: Black, White, Yellow;
Number of Layers: 1-32;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Service: One-Stop Turnkey;
Maximum Board Size: 640mm*1100mm;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
Structure: Metal Base Rigid PCB;
Dielectric: CEM-1;
Material: Polyester Glass Fiber Mat Laminate;
Application: Aerospace;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: QA Inspection and Ect.;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White and Ect.;
Surface Finishedc: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Conditions: New;
Supplier Name

Usun Electronics Limited.,

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Okey Circuit Co., Ltd.

Diamond Member Audited Supplier