PCB
US$0.50 / Piece
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What is Competitive Price and Free Lead PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.50 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Paper Phenolic Copper Foil Substrate
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum Package
  • Specification Normal
  • Trademark OEM
  • Origin China
  • Copper Thickness 1oz
  • Surface Finishing OSP
  • Solder Mask Type Green
  • Silkscreen White
  • Board Thickness 2.0mm
  • Min. Hole Size 0.2mm
  • Min. Line Width 0.15mm
  • Min. Line Spacing 0.15mm
  • Certificates UL, RoHS, SGS, ISO9001
  • Shipping DHL, UPS, TNT, FedEx, etc

Product Description

Competitive price pcb, Free lead PCB, Pcb board 1. Board thickness: 2.0mm 2. Material: FR4 3. Surface Finishing: OSP 4. Soldermask: Green 5. Min. Hole Size: 0.2mm 6. Certificates: UL, RoHS, SGS, ISO9001 7. Shipping: DHL, UPS, TNT, FedEx, etc Our PCB board manufacture and PCB assembly ...

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PCB Comparison
Transaction Info
Price US $ 0.5/ Piece US $ 0.10-100.00/ Piece US $ 0.10-100.00/ Piece US $ 0.10-100.00/ Piece US $ 0.10-100.00/ Piece
Min Order 1 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Trade Terms FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P L/C, T/T, D/P L/C, T/T, D/P L/C, T/T, D/P
Quality Control
Product Certification - RoHS, UL, ISO RoHS, UL, ISO RoHS, UL, ISO RoHS, UL, ISO
Management System Certification ISO 9001, ISO 14001 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Europe, Southeast Asia/ Mideast, Africa, Domestic South America, Europe, Southeast Asia/ Mideast, Africa, Domestic South America, Europe, Southeast Asia/ Mideast, Africa, Domestic South America, Europe, Southeast Asia/ Mideast, Africa, Domestic
Annual Export Revenue - - - - -
Business Model OEM, ODM - - - -
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 2.0mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Supplier Name

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier