What is Professional PCB Board Manufacturer, Multilayer PCB Manufacturing

Name: Professional PCB Board Manufacturer, Multilayer PCB Manufacturing
Uploaded: 2023-08-04T15:38:38+08:00
Description: Welcome To Shenzhen XINJIA YE Ltd. Testing Procedures For PCB Board: *Visual Inspection *Flying probe *Bed of nails *Impedance control *Solder-ability detection *Digital metallograghic microscope *AO

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$1.00-5.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Fr4
Application Consumer Electronics
Flame Retardant Properties 94V0
Processing Technology Delay Pressure Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Organic Resin
Brand Xjy
Transport Package Vacuum Plastic and Carton
Specification Normal
Trademark XJY
Origin China
Board Size Customized
Maximum Size 500mm*800mm
Board Color Green/Black/Red/Yellow Customized
Silkscreen Color Green/Black/Red/Yellow Customized
Design Improvement Available
Min. Line Space 0.1mm
Min.Hole Size 0.15mm
Board Thickness 0.2mm-6.0mm
Aspect Ratio 13:1
Insulation Layer Thickness 0.075mm-5.0mm

Product Description

Welcome To Shenzhen XINJIA YE Ltd. Testing Procedures For PCB Board: *Visual Inspection *Flying probe *Bed of nails *Impedance control *Solder-ability detection *Digital metallograghic microscope *AOI (Automated Optical Inspection) Detailed Terms for PCB Manufacturing: * Professional ...

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Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Gold Member Since 2013

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products PCB, PCB Board, Aluminum PCB, FPC, PCBA, LED PCB, PCB Assembly, Printed Circuit Board, Rigid PCB, MCPCB
Terms of Payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Layout Design Comparison

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Transaction Info
	Quick View Professional PCB Board Manufacturer, Multilayer PCB Manufacturing Contact Now	Quick View Electrolytic Foil Subtractive Process King Field/OEM Vacuum Packaging Ccl Sheet Aluminum PCB Board Contact Now	Quick View V0 Electrolytic Foil King Field/OEM Vacuum Packaging 100*585 China PCB Contact Now	Quick View Subtractive Process V0 King Field/OEM Ru 94V0 Rigid Circuit Boards PCB Contact Now	Quick View Electrolytic Foil Medical Instruments King Field/OEM Vacuum Packaging Board LED PCB Contact Now
Price	US $ 1.00-5.00/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, WeChat/Alipay	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification	-	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS
Management System Certification	ISO 9001, ISO 14001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Fr4; Application: Consumer Electronics; Flame Retardant Properties: 94V0; Processing Technology: Delay Pressure Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Xjy; Board Size: Customized; Maximum Size: 500mm800mm;* Board Color: Green/Black/Red/Yellow Customized; Silkscreen Color: Green/Black/Red/Yellow Customized; Design Improvement: Available; Min. Line Space: 0.1mm; Min.Hole Size: 0.15mm; Board Thickness: 0.2mm-6.0mm; Aspect Ratio: 13:1; Insulation Layer Thickness: 0.075mm-5.0mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;
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