Specification |
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finishing: Lf-Hal;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: Green;
Size: 35*45mm;
Package: Vacuum;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-210um(6oz);
Service: OEM/ODM, EMS;
Materials: Fr-4/Fr-4tg170//Aluminum-Based Materials;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-210um(6oz);
Service: OEM/ODM, EMS;
Materials: Fr-4/Fr-4tg170//Aluminum-Based Materials;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-210um(6oz);
Service: OEM/ODM, EMS;
Materials: Fr-4/Fr-4tg170//Aluminum-Based Materials;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
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