Printed Circuit Board
US$0.10-0.50 / Piece
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What is Printed Circuit Board for Electronic Products Function PCB Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-0.50 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Organic Resin
  • Transport Package Vacuum Package
  • Specification Normal
  • Trademark OEM
  • Origin China
  • Copper Thickness 1oz
  • Surface Finishing OSP
  • Solder Mask Type Green
  • Silkscreen White
  • Board Thickness 2.0mm
  • Min. Hole Size 0.2mm
  • Min. Line Width 0.15mm
  • Min. Line Spacing 0.15mm
  • Certificates UL, RoHS, SGS, ISO9001
  • Shipping DHL, UPS, TNT, FedEx, etc

Product Description

Welcome to XJY------------ Shenzhen Xinjiaye Electronics Technology Co., Ltd is a professional pcb manufacturer has over 10 years experience. We are able to offer 1 to 24 Layer PCB, ranging from pcb produce, components purchase, pcb assembly, pcb copy service.Our products are ...

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Printed Circuit Board Comparison
Transaction Info
Price US $ 0.10-0.50/ Piece US $ 35/ Piece US $ 35/ Piece US $ 35/ Piece US $ 35/ Piece
Min Order 1 Pieces 500 Pieces 500 Pieces 500 Pieces 500 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
Annual Export Revenue US$50 Million - US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 2.0mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Supplier Name

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Gold Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier