High-Density PCB Manufacturing
US$1.51-1.52 / Piece
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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$1.52

1,000+ Pieces US$1.51

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm, Rogers
  • Transport Package Vacuum Packaging
  • Specification 40*60mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Enig

Product Description

Specifications: Layers: 6 Thickness:0.6mm Material: FR4 KB6160 Size:40*60mm Surface treatment:ENIG Line width/spacing: 0.127/0.127mm Minimum aperture: 0.25mm Solder mask color: Green Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very ...

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High-Density PCB Manufacturing Comparison
Transaction Info
Price US $ 1.51-1.52/ Piece US $ 27/ Square Meter US $ 75/ Piece US $ 0.15/ Piece US $ 0.1/ Piece
Min Order 10 Pieces 1 Square Meters 1 Pieces 1 Pieces 1 Pieces
Trade Terms - FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
Payment Terms T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram, cash L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - - - UL, ISO9001 UL, ISO9001
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm, Rogers;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xjy;
Layer: 1 to 28;
Min.Line Width: 5mil;
Min.Hole Size: 0.28mm;
Min.Line Sapcing: 6mil;
Soldermask: Green;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Xjy;
Surface Finishing: Hf-HASL;
Copper Thickness: 35um;
Board Thickness: 1.2mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
Silkscreen Color: Green,;
Layers: 1 to 8;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 2oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Space: 0.075mm;
Min. Line Width: 0.075mm;
Solder Mask: Green;
Test: Aoi;
Package: Vacuum Package;
Small Order: Accept;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Xjy;
Surface Finishing: Hf-HASL;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Wigth: 0.1mm;
Min. Line Spacing: 0.1mm;
Layer: 1 to 24;
Solder Mask: Green, Red, Blue, White, Yellow;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier