| Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surface Treatment: Immersion Gold;
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Structure: Metal Base Rigid PCB;
Dielectric: Al;
Material: Al;
Application: PCB;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Hfi;
Size: 1020*2040;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Materials: Fr-4, Cem1, Cem3, Aluminum, Copper;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irre;
Qualified: Ipc-a-610 Class 2;
Thick Copper: 18um-210um(6oz);
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Service: OEM/ODM, EMS;
Profiling Punching: Routing,V-Cut, Beveling;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
OEM/ODM/EMS: PCBA, PCBA Aassembly: SMT & Pth & BGA;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-210um(6oz);
Service: OEM/ODM, EMS;
Materials: Fr-4/Fr-4tg170//Aluminum-Based Materials;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
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