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US$3.23-3.24 / Piece

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Multi-Layer Communication Board for Base Stations pictures & photos

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What is Multi-Layer Communication Board for Base Stations

Name: Multi-Layer Communication Board for Base Stations
Uploaded: 2024-05-27T17:56:56+08:00
Description: Specifications: Layers:4 Thickness:2.0mm Material: FR4 KB6160 Size:140*180mm Surface treatment:ENIG Line width/spacing: 0.112/0.112mm Minimum aperture: 0.2mm Solder mask color: Green Finished copper t

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$3.24

1,000+ Pieces US$3.23

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Shengyi, Kb, Nanya, Ilm, Rogers
Transport Package Vacuum Packaging
Specification 140*180mm
Trademark XMANDA
Origin Made in China
Criteria Aql II 0.65
Hole Sizes 0.25mm
Bevel Edge Yes
Impedance 50/90/100 Ohm
Trace Width(Min.) 4mil
Surfaec Treatment Enig

Product Description

Specifications: Layers:4 Thickness:2.0mm Material: FR4 KB6160 Size:140*180mm Surface treatment:ENIG Line width/spacing: 0.112/0.112mm Minimum aperture: 0.2mm Solder mask color: Green Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very ...

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Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Range Consumer Electronics, Electrical & Electronics, Instruments & Meters
Main Products PCB, Double-Sided PCB, Multilayer PCB, Printed Circuit Board, Aluminum PCB, PCB Assembly, PCBA, Flexible PCB, Electronic Component, PCB Circuit
OEM/ODM Availability Yes

Advanced Camera System Comparison

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Transaction Info
	Quick View Multi-Layer Communication Board for Base Stations Contact Now	Quick View Professional Design OEM and ODM Electronics Multilayer Printed Circuit Board and PCBA Manufacturer Isola 408hr PCB with Test Report Contact Now	Quick View Medical Circuit Board 10 Layers High Tg Fr4 2.0 mm Thickness Impedance Control Demand Multilayer PCB Altium with UL Contact Now	Quick View Enig for Whold Bottom Side 2 Layer Dark Green Solder Mask HASL Multilayer PCB Board Price for Industrial Device Contact Now	Quick View Factory Produce High Frequency and Half Hole Rogers 4003 1.6mm Thickness Enig Surface Finish Multilayer PCB Inductor Calculator Contact Now
Price	US $ 3.23-3.24/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	10 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	-	-	-	-
Trade Capacity
Export Markets	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm, Rogers; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Enig;	Type: Rigid Circuit Board; Dielectric: Rogers Material; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: RO5880; Insulation Materials: Epoxy Resin; Brand: Kxpcba; Shape: Rectangular, Round, Slots, Cutouts, Complex; Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil; PCB Testing: E-Test, Fly Probe Test, Visual Checking; Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil); Copper Thickness: 0.5-12oz(18-420um); Board Thickness: 0.2-6.0mm; Min. Line Width: 0.075mm(3mil); Min. Line Spacing: 0.075mm(3mil); Min Width of Annular Ring: 0.15mm(6mil); Service: 724 Hours Online;*	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;
Supplier Name	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd
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