What is Flexible Rigid-Flex Printed Circuit Board Design

Name: Flexible Rigid-Flex Printed Circuit Board Design
Uploaded: 2024-04-18T17:38:17+08:00
Description: Specifications: Layers:4 Thickness: 1.6mm Material: FR-4 Size: 120*65mm Surface treatment:ENIG Line width/spacing: 6/6mil Minimum aperture: 0.3mm Solder mask color: green Finished copper thickne

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$0.65

1,000+ Pieces US$0.60

Sepcifications

Insulation Materials Epoxy Resin
Flame Retardant Properties V0
Application Medical Instruments
Transport Package Vacuum Packaging
Specification 56*62mm
Trademark XMANDA
Origin Made in China
Criteria Aql II 0.65
Hole Sizes 0.15mm/0.2mm
Bevel Edge Yes
Impedance 50/90/100 Ohm
Trace Width(Min.) 4mil
Surfaec Treatment Enig

Product Description

Specifications: Layers:4 Thickness: 1.6mm Material: FR-4 Size: 120*65mm Surface treatment:ENIG Line width/spacing: 6/6mil Minimum aperture: 0.3mm Solder mask color: green Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ Features: 1. The integration of the board design ...

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Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Range Consumer Electronics, Electrical & Electronics, Instruments & Meters
Main Products PCB, Double-Sided PCB, Multilayer PCB, Printed Circuit Board, Aluminum PCB, PCB Assembly, PCBA, Flexible PCB, Electronic Component, PCB Circuit
OEM/ODM Availability Yes

Automotive Rigid-Flex PCB Manufacturer Comparison

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Transaction Info
	Quick View Flexible Rigid-Flex Printed Circuit Board Design Contact Now	Quick View 6layer Rigid-Flex PCB Material Mce-G-700g 1.5mm 1oz for High-Definition Car Camera Contact Now	Quick View 14layer High Tg180 Rigid-Flex PCB with Blind/Buried Vias HDI for Enterprise-Class SSD Contact Now	Quick View 3layer Rigid PCB 1.6mm Thickness + 2layer FPC Enig Rigid-Flex PCB for Industrial Control Computer Contact Now	Quick View 10layer Rigid-Flex PCB Consumer Electronics Module PCB Contact Now
Price	US $ 0.60-0.65/ Piece	US $ 1.78-7.25/ Piece	US $ 4.95-16.80/ Piece	US $ 0.635-5.79/ Piece	US $ 0.62-3.78/ Piece
Min Order	10 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	-	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Insulation Materials: Epoxy Resin; Flame Retardant Properties: V0; Application: Medical Instruments; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Enig;	Insulation Materials: Organic Resin; Flame Retardant Properties: V0; Application: Medical Instruments; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Conductive Adhesive: Conductive Silver Paste; Processing Technology: Enig; Base Material: Fr4+Pi+Nfpp; Structure: Multilayer PCB+FPC; 1: 1;	Insulation Materials: Organic Resin; Flame Retardant Properties: V0; Application: Aerospace; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Conductive Adhesive: Conductive Silver Paste; Processing Technology: Enig+OSP; Base Material: Fr4+Pi+Nfpp; Structure: Multilayer PCB+FPC;	Insulation Materials: Organic Resin; Flame Retardant Properties: V0; Application: Medical Instruments; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Conductive Adhesive: Conductive Silver Paste; Processing Technology: Enig+OSP; Base Material: Fr4+Pi+Nfpp; Structure: Multilayer PCB+FPC;	Insulation Materials: Organic Resin; Flame Retardant Properties: V0; Application: Consumer Electronics, Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Conductive Adhesive: Conductive Silver Paste; Structure: Multilayer PCB+FPC; Processing Technology: Enig+OSP; Base Material: Fr4+Pi+Nfpp;
Supplier Name	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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