Advanced Four-Layer PCB for Intelligent Smartphone Motherboard Video

Name: Advanced Four-Layer PCB for Intelligent Smartphone Motherboard
Uploaded: 2024-05-27T17:08:53+08:00
Description: Specifications: Layers: 4 Thickness: 1.6mm Material: FR-4 Size:45*100mm Surface treatment: ENIG Line width/spacing: 5/5mil Minimum aperture: 0.25mm Solder mask color: green Finished copper thickness:

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$0.80

1,000+ Pieces US$0.75

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Communication
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Shengyi, Kb, Nanya, Ilm
Transport Package Vacuum Packaging
Specification 45*100mm
Trademark XMANDA
Origin Made in China
Criteria Aql II 0.65
Hole Sizes 0.25mm
Bevel Edge Yes
Impedance 50/90/100 Ohm
Trace Width(Min.) 4mil
Surfaec Treatment Enig

Product Description

Specifications: Layers: 4 Thickness: 1.6mm Material: FR-4 Size:45*100mm Surface treatment: ENIG Line width/spacing: 5/5mil Minimum aperture: 0.25mm Solder mask color: green Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very high, the ...

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Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Range Consumer Electronics, Electrical & Electronics, Instruments & Meters
Main Products PCB, Double-Sided PCB, Multilayer PCB, Printed Circuit Board, Aluminum PCB, PCB Assembly, PCBA, Flexible PCB, Electronic Component, PCB Circuit
OEM/ODM Availability Yes

Smart TV Electronics Comparison

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Transaction Info
	Quick View Advanced Four-Layer PCB for Intelligent Smartphone Motherboard Contact Now	Quick View Military Class Printed Circuit Board for Sensor Amplifier RFID System Contact Now	Quick View It158 Material Costomize 16layer PCB Circuit Board for RFID Read and Write Module Contact Now	Quick View Customizing Multilayer PCB 12layer Circuit Board for Digital Temperature & Humidity Sensors Contact Now	4L Single-Sided Aluminium PCB 2W 2oz Hal Contact Now
Price	US $ 0.75-0.80/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	Negotiable
Min Order	10 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	L/C, T/T, D/P
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001
Trade Capacity
Export Markets	-	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Enig;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Military; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6L up to 60L; Board Thickness: 1.6mm up to 8mm; Min Hole Size: 0.25mm; Min. Hole Wall Cu: 25um; Finished Copper: 35um; Min. Trace/Space: 0.23/0.13mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Military; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 16L up to 60L; Board Thickness: 1.89mm up to 8mm; Min Hole Size: 0.25mm; Min. Hole Wall Cu: 25um; Finished Copper: 35um; Min. Trace/Space: 0.075/0.0905mm; Surface Finish: Immersion Gold;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Military; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 12L up to 60L; Board Thickness: 2mm up to 8mm; Min Hole Size: 0.25mm; Min. Hole Wall Cu: 25um; Finished Copper: 45um; Min. Trace/Space: 0.129/0.107mm; Surface Finish: Immersion Gold Au3u";	Structure: Single-Sided Rigid PCB; Base Material: Aluminum; Brand: Dejia;
Supplier Name	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Zhejiang Dejia Electronics Technology Co.,Ltd.
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