Reliable Network Connectivity
US$1.50-1.55 / Piece
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What is Premium Four-Layer Gold PCB Communication Device

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$1.55

1,000+ Pieces US$1.50

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Semi-Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 100*120mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Enig

Product Description

Specifications: Layers: 4 Thickness: 2.60mm Material: FR4 KB6160 Size: 100*120mm Surface treatment: ENIG Line width/spacing: /mm Minimum aperture: 0.65mm Solder mask color: Green Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very high, ...

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Reliable Network Connectivity Comparison
Transaction Info
Price US $ 1.50-1.55/ Piece US $ 0.33-0.46/ piece US $ 0.12-6.65/ Piece Negotiable US $ 0.91-0.98/ piece
Min Order 10 Pieces 1 piece 1 Pieces 1 Pieces 1 piece
Trade Terms - - - - -
Payment Terms T/T L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: FL;
Soldermask: Red;
Silkscreen: Black;
Materials: Fr4;
Surface: Enig;
MOQ: 1PCS;
Service: Fast Deliver;
Board Thickness: 3.2;
Copper Thickness: 2oz;
Mini Holes: 0.1mm;
Mini Track: 3mil/3mil;
Test: 100%;
Small Order: Accept;
Lead Time: 5-6days;
Package: Carton;
Delivery: DHL/FedEx/UPS;
Structure: 8 Layer;
Dielectric: FR-4;
Material: Fr4;
Application: Aerospace;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: FL;
Board Material: Fr-4 (Tg 170 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: Immersion Gold;
Solder Mask: Green;
Silk Screen: White;
Flying Probe Test: Yes;
Product Name: Immersion Gold Circuit Board Multilayer PCB;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier