Advanced Server Mainboard
US$1.31-1.32 / Piece
View
  • Recommend for you
  • What is High-Frequency Microwave Induction Module Board with 50/90/100 Ohm Impedance
  • What is Smart Wearable Six-Layer PCB with HDI Technology
  • What is Premium Quality 6-Layer Enig Coated PCB

What is Four-Layer Gold Plated Wearable PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$1.32

1,000+ Pieces US$1.31

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 60*60mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 0.102mm/0.102mm
  • Surfaec Treatment Enig

Product Description

Specifications: Layers:4 Thickness:0.6mm Material: FR-4 Size:60*60mm Surface treatment: ENIG Line width/spacing:0.102mm/0.102mm Minimum aperture:0.25mm Solder mask color:Blue Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very high, the ...

Learn More

Advanced Server Mainboard Comparison
Transaction Info
Price US $ 1.31-1.32/ Piece US $ 0.01-20.00/ Piece US $ 0.01-100.00/ Piece US $ 0.01-100.00/ piece US $ 0.10-0.50/ pcs
Min Order 10 Pieces 1 Pieces 1 Pieces 1 piece 1 pcs
Trade Terms - - - - -
Payment Terms T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net T/T, Western Union, Paypal, 30 days net
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM OEM OEM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 0.102mm/0.102mm;
Surfaec Treatment: Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Thickness: 0.15/0.8/1.0/1.6/2.0/2.4/2.8/3.0/3.2mm;
Inner Copper: 1/2/3/4 Oz;
Finish Copper: 1/2/3/4 Oz;
Surface Finish: Enig/HASL/HASL Lf/OSP;
Solder Mask: Green/White/Red/Orange/Purple;
Type: Rigid Circuit Board;
Dielectric: CEM-1;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
out Layer Copper Thickness: 18um--350um;
Inner Layer Copper Thickness: 17um--175um;
Minimum Line: 0.075mm;
Minimum Space: 0.075mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layers: 1-20 Layers;
Solder Mask: Blue or on Your Request;
Legend: White or on Your Request;
Copper Thickness: 70 Um;
Board Thickness: 2.0mm;
Surface Finish: HASL, Enig, Tin, Flash Gold, OSP, Gold Finger;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Auto;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier