Four-Layer 5g Communication Board
US$1.31-1.32 / Piece
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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$1.32

1,000+ Pieces US$1.31

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm, Rogers
  • Transport Package Vacuum Packaging
  • Specification 80*80mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Enig

Product Description

Specifications: Layers: 4 Thickness: 0.6mm Material: FR4 KB6160 Size:80*80mm Surface treatment:ENIG Line width/spacing: 0.12/0.08mm Minimum aperture: 0.3mm Solder mask color: Green Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very high, the ...

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Four-Layer 5g Communication Board Comparison
Transaction Info
Price US $ 1.31-1.32/ Piece US $ 0.08-0.10/ PCS Negotiable Negotiable Negotiable
Min Order 10 Pieces 1 PCS 1 pcs 1 pcs 1 pcs
Trade Terms - - - - -
Payment Terms T/T L/C, T/T, Western Union L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification - ISO,UL,RoHS - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 13485 ISO 9001, ISO 9000, ISO 13485 ISO 9001, ISO 9000, ISO 13485
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm, Rogers;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 2oz;
Condition: Original Made;
Type: Polymer Ceramic Copper;
Dielectric: Polymer Ceramic Copper;
Material: Copper;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Wl;
Dielectric Constant: 3.38±0.05;
Size(mm): 610X460, 600X500,915X1220;
Dielectric Thickness: 1.016mm;
Density(G/ Cm3): 1.78;
Moisture Absoption: 0.07;
Type: Polymer Ceramic Copper;
Dielectric: Polymer Ceramic Copper;
Material: Copper;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Wl;
Pimd: Less Than -158dbc;
Sample: Available;
Dielectric Thickness: 1.034mm;
Density(G/ Cm3): 1.57;
Dielectric Constant: 3.0±0.05;
Type of Copper Foil: RTF Copper Foil;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Dielectric Constant: 3.38±0.05;
Size(mm): 610X460, 600X500,915X1220;
Dielectric Thickness: 0.526-1.542;
Density(G/ Cm3): 1.78;
Moisture Absoption: 0.07;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

New Vision Meditec Co., Limited

China Supplier - Gold Member Audited Supplier

New Vision Meditec Co., Limited

China Supplier - Gold Member Audited Supplier

New Vision Meditec Co., Limited

China Supplier - Gold Member Audited Supplier