8-Layer Gold PCB for Network Communication Video

Name: 8-Layer Gold PCB for Network Communication
Uploaded: 2024-06-06T11:12:11+08:00
Description: Specifications: Layers: 8 Thickness:1.6mm Material: FR4 KB6160 Size:140*260mm Surface treatment:ENIG Line width/spacing: 0.091/0.12mm Minimum aperture: 0.25mm Solder mask color: Green Finished copper

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$34.90

1,000+ Pieces US$34.85

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Shengyi, Kb, Nanya, Ilm, Rogers
Transport Package Vacuum Packaging
Specification 140*260mm
Trademark XMANDA
Origin Made in China
Criteria Aql II 0.65
Hole Sizes 0.25mm
Bevel Edge Yes
Impedance 50/90/100 Ohm
Trace Width(Min.) 4mil
Surfaec Treatment Enig

Product Description

Specifications: Layers: 8 Thickness:1.6mm Material: FR4 KB6160 Size:140*260mm Surface treatment:ENIG Line width/spacing: 0.091/0.12mm Minimum aperture: 0.25mm Solder mask color: Green Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very high, ...

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Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Range Consumer Electronics, Electrical & Electronics, Instruments & Meters
Main Products PCB, Double-Sided PCB, Multilayer PCB, Printed Circuit Board, Aluminum PCB, PCB Assembly, PCBA, Flexible PCB, Electronic Component, PCB Circuit
OEM/ODM Availability Yes

Mainboard with Multiple Layers Comparison

	Quick View 8-Layer Gold PCB for Network Communication Contact Now	Quick View Customized Multi-Layer PCB PCBA Board Assembly Contact Now	Quick View High Reliable OSP Multilayer Pcbs Conctroller Mainboards Contact Now	Quick View High Standard Quality T-Eflon Circuit Board PTFE High Frequency PCB Factory Contact Now	Quick View High Thermal Conductivity PCB Ceramic Substrate Special Process for Household Appliances Contact Now

Transaction Info
	Quick View 8-Layer Gold PCB for Network Communication Contact Now	Quick View Customized Multi-Layer PCB PCBA Board Assembly Contact Now	Quick View High Reliable OSP Multilayer Pcbs Conctroller Mainboards Contact Now	Quick View High Standard Quality T-Eflon Circuit Board PTFE High Frequency PCB Factory Contact Now	Quick View High Thermal Conductivity PCB Ceramic Substrate Special Process for Household Appliances Contact Now
Price	US $ 34.85-34.90/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-20.00/ Piece	US $ 0.10-20.00/ Piece	US $ 0.10-20.00/ Piece
Min Order	10 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T	L/C, T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, BSCI	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485
Trade Capacity
Export Markets	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	-	-	-
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: 1-3 Month(s)	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm, Rogers; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Enig;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Customize; Brand: OEM;	Type: Rigid Circuit Board; Material: Fr4; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Hl-PCB; Surface Treatment: OSP; Mini Hole Diameter: 0.3mm; Borad Thickness: 1.6mm; Count Layer: 4; Inner/Outer Copper Thickness: 1oz/1oz; Min Trace Width/Spacing: 0.2mm / 0.2mm; Special: High Reliability;	Type: Rigid Circuit Board; Material: Fjy255A; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Hl-PCB; Surface Treatment: Immersion Tin; Mini Hole Diameter: 0.5mm; Borad Thickness: 0.8mm; Count Layer: 2; Inner/Outer Copper Thickness: 1oz/1oz; Min Trace Width/Spacing: 47mil/12.8mil; Special: High Freqency Material;	Type: Rigid Circuit Board; Material: Ceramic Substrate; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Hl-PCB; Surface Treatment: Immersion Au; Mini Hole Diameter: 0.3mm; Borad Thickness: 2.6mm; Count Layer: 2; Inner/Outer Copper Thickness: 1oz/1oz; Min Trace Width/Spacing: 5mil/5mil; Special: Ceramic Substrate, High Thermal Conductivity; Certificated: ISO9001, ISO14001, IATF16949, UL, RoHS, CQC etc.;
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